PATENT LICENSE AND SETTLEMENT AGREEMENTPatent License and Settlement Agreement • February 23rd, 2012 • Spansion Inc. • Semiconductors & related devices • California
Contract Type FiledFebruary 23rd, 2012 Company Industry JurisdictionThis PATENT LICENSE AND SETTLEMENT AGREEMENT (“Agreement”) is made as of July 18, 2011 (the “Effective Date”) between SAMSUNG ELECTRONICS CO. LTD. (“Samsung”) and SPANSION INC. (“Spansion”) and their respective Subsidiaries (as defined below).