CREDIT AGREEMENT dated as of June 27, 2013 among MICROCHIP TECHNOLOGY INCORPORATED The Lenders Party Hereto JPMORGAN CHASE BANK, N.A. as Administrative Agent WELLS FARGO BANK, NATIONAL ASSOCIATION, BANK OF AMERICA, N.A., HSBC BANK USA, NATIONAL...Credit Agreement • June 28th, 2013 • Microchip Technology Inc • Semiconductors & related devices • New York
CREDIT AGREEMENT (this “Agreement”) dated as of June 27, 2013 among MICROCHIP TECHNOLOGY INCORPORATED, the LENDERS from time to time party hereto, JPMORGAN CHASE BANK, N.A., as Administrative Agent, WELLS FARGO BANK, NATIONAL ASSOCIATION, BANK OF AMERICA, N.A., HSBC BANK USA, NATIONAL ASSOCIATION and U.S. BANK NATIONAL ASSOCIATION, as Co-Syndication Agents, and SUNTRUST BANK, BMO HARRIS BANK, N.A., MORGAN STANLEY MUFG LOAN PARTNERS, LLC (acting through The Bank of Tokyo-Mitsubishi UFJ, Ltd. and Morgan Stanley Bank, N.A.), COMPASS BANK, FIFTH THIRD BANK and SUMITOMO MITSUI BANKING CORPORATION, as Co-Documentation Agents.
