0001193125-13-427862 Sample Contracts

AGREEMENT AND PLAN OF MERGER by and among: MINDSPEED TECHNOLOGIES, INC. a Delaware corporation; M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC. a Delaware corporation; and MICRO MERGER SUB, INC. a Delaware corporation Dated as of November 5, 2013

Agreement and Plan of Merger • November 5th, 2013 • M/a-Com Technology Solutions Holdings, Inc. • Semiconductors & related devices • Delaware

• Contract Type
  Agreement and Plan of Merger
• Filed
  November 5th, 2013
• Company
  M/a-Com Technology Solutions Holdings, Inc.
• Industry
  Semiconductors & related devices
• Jurisdiction
  Delaware

THIS AGREEMENT AND PLAN OF MERGER (“Agreement”) is made and entered into as of November 5, 2013 by and among: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC., a Delaware corporation (“Parent”); Micro Merger Sub, Inc., a Delaware corporation and a wholly owned subsidiary of Parent (“Purchaser”); and MINDSPEED TECHNOLOGIES, INC., a Delaware corporation (the “Company”). Certain capitalized terms used in this Agreement are defined in Exhibit A.