LOAN AND SECURITY AGREEMENT Dated as of November 12, 2013 ADVANCED MICRO DEVICES, INC., and AMD INTERNATIONAL SALES & SERVICE, LTD., as Borrowers BANK OF AMERICA, N.A., as Agent MERRILL LYNCH, PIERCE, FENNER & SMITH INCORPORATED, as Joint Lead...Loan and Security Agreement • November 12th, 2013 • Advanced Micro Devices Inc • Semiconductors & related devices • California
THIS LOAN AND SECURITY AGREEMENT is dated as of November 12, 2013, among ADVANCED MICRO DEVICES, INC., a Delaware corporation (“Parent”), AMD INTERNATIONAL SALES & SERVICE, LTD., a Delaware corporation (“AMDISS”; together with Parent, individually, a “Borrower” and, collectively, the “Borrowers”), the financial institutions party to this Agreement from time to time as lenders (collectively, “Lenders”), and BANK OF AMERICA, N.A., a national banking association, as agent for the Lenders (“Agent”).
