REGISTRATION RIGHTS AGREEMENT by and among EnPro Industries, Inc. and Applied Surface Technology, Inc., Belfab, Inc., Best Holdings I, Inc., Coltec Industries Inc, Coltec International Services Co., Compressor Products International LLC, EnPro...Registration Rights Agreement • September 16th, 2014 • Enpro Industries, Inc • Gaskets, packg & sealg devices & rubber & plastics hose • New York
This Registration Rights Agreement (this “Agreement”) is made and entered into as of September 16, 2014, by and among EnPro Industries, Inc., a North Carolina corporation (the “Company”), Applied Surface Technology, Inc., Belfab, Inc., Best Holdings I, Inc., Coltec Industries Inc, Coltec International Services Co., Compressor Products International LLC, EnPro Associates, LLC, Garlock Pipeline Technologies, Inc., GGB LLC, GGB, Inc., Kenlee Daytona LLC, SD Friction, LLC, Stemco Holdings, Inc., STEMCO Kaiser Incorporated, Stemco LP, Stemco Products, Inc., Technetics Group Daytona, Inc. and Technetics Group LLC, as Guarantors (collectively, the “Guarantors”), and Merrill Lynch, Pierce, Fenner & Smith Incorporated (“Merrill Lynch”), on behalf of itself and as representative of the several initial purchasers named on Schedule A of the Purchase Agreement (the “Initial Purchasers”), each of whom has agreed to purchase the Company’s 5.875% Senior Notes due 2022 (collectively, the “Initial Notes
ENPRO INDUSTRIES, INC. as Company and the Guarantors party hereto from time to time 5.875% Senior Notes due 2022 INDENTURE Dated as of September 16, 2014 and U.S. Bank National Association as TrusteeSupplemental Indenture • September 16th, 2014 • Enpro Industries, Inc • Gaskets, packg & sealg devices & rubber & plastics hose • New York
INDENTURE, dated as of September 16, 2014, among ENPRO INDUSTRIES, INC., a North Carolina corporation (together with its successors and assigns, the “Company”), the Guarantors party hereto from time to time (as defined below) and U.S. Bank National Association, a national banking association, as Trustee (as defined below).
