CREDIT AGREEMENT dated as of September 26, 2014 among FAIRCHILD SEMICONDUCTOR CORPORATION, as the Borrower, FAIRCHILD SEMICONDUCTOR INTERNATIONAL, INC., as Holdings, BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer,...Credit Agreement • November 6th, 2014 • Fairchild Semiconductor International Inc • Semiconductors & related devices • New York
This CREDIT AGREEMENT is entered into as of September 26, 2014 among FAIRCHILD SEMICONDUCTOR CORPORATION, a Delaware corporation (the “Borrower”), FAIRCHILD SEMICONDUCTOR INTERNATIONAL, INC., a Delaware corporation (“Holdings”), the Lenders (defined herein) and BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer.
