0001193125-16-605513 Sample Contracts

AGREEMENT
Agreement • May 27th, 2016 • MAGNACHIP SEMICONDUCTOR Corp • Semiconductors & related devices • Delaware

This Agreement (this “Agreement”) is made and entered into as of May 26, 2016, by and among MagnaChip Semiconductor Corporation (the “Company”), Engaged Capital Master Feeder II, LP (“Engaged Capital Master II”), Engaged Capital Master Feeder I, LP (“Engaged Capital Master I”), Engaged Capital I, LP (“Engaged Capital I”), Engaged Capital I Offshore, Ltd. (“Engaged Capital Offshore”), Engaged Capital II, LP (“Engaged Capital II”), Engaged Capital II Offshore Ltd. (“Engaged Capital Offshore II”), Engaged Capital, LLC (“Engaged Capital”), Engaged Capital Holdings, LLC (“Engaged Holdings”) and Glenn W. Welling (“Welling”, and together with Engaged Capital Master II, Engaged Capital Master I, Engaged Capital I, Engaged Capital Offshore, Engaged Capital II, Engaged Capital Offshore II, Engaged Capital and Engaged Holdings, the “Engaged Stockholders”) (each of the Company and the Engaged Stockholders, a “Party” to this Agreement, and collectively, the “Parties”).

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