AGREEMENT AND PLAN OF MERGER by and among SAMSUNG ELECTRONICS CO., LTD., SAMSUNG ELECTRONICS AMERICA, INC., SILK DELAWARE, INC. and HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED dated as of November 14, 2016Agreement and Plan of Merger • November 14th, 2016 • Harman International Industries Inc /De/ • Household audio & video equipment • Delaware
This AGREEMENT AND PLAN OF MERGER (this “Agreement”), dated as of November 14, 2016, is entered into by and among Samsung Electronics Co., Ltd., a Korean corporation (“Parent”), Samsung Electronics America, Inc., a New York corporation and wholly owned subsidiary of Parent (“Silk USA”), Silk Delaware, Inc., a Delaware corporation and wholly owned subsidiary of Silk USA (“Merger Sub”), and Harman International Industries, Incorporated, a Delaware corporation (the “Company”). Each of Parent, Silk USA, Merger Sub and the Company is referred to herein as a “Party” and together as “Parties.” Capitalized terms used and not otherwise defined herein have the meanings set forth in Section 9.01.
