TENDER AND SUPPORT AGREEMENTTender and Support Agreement • February 13th, 2017 • Integrated Device Technology Inc • Semiconductors & related devices • Delaware
This TENDER AND SUPPORT AGREEMENT (this “Agreement”), dated as of February 13, 2017, is entered into by and among Integrated Device Technology, Inc., a Delaware corporation (“Parent”), Glider Merger Sub, Inc., a Delaware corporation and a wholly-owned Subsidiary of Parent (the “Purchaser”), and each of the Persons set forth on Schedule A hereto (each, a “Stockholder”). All capitalized terms used but not otherwise defined in this Agreement shall have the respective meanings ascribed to such terms in the Merger Agreement (as defined below).
