CREDIT AGREEMENT dated as of April 4, 2017 among INTEGRATED DEVICE TECHNOLOGY, INC., The Lenders Party Hereto, and JPMORGAN CHASE BANK, N.A., as Administrative Agent and Collateral Agent JPMORGAN CHASE BANK, N.A., as Sole Lead Arranger and Sole BookrunnerCredit Agreement • April 4th, 2017 • Integrated Device Technology Inc • Semiconductors & related devices • New York
CREDIT AGREEMENT (this “Agreement”) dated as of April 4, 2017, among Integrated Device Technology, Inc., a Delaware corporation (the “Borrower”), the Lenders party hereto and JPMorgan Chase Bank, N.A., as Administrative Agent and Collateral Agent.
