INDEMNIFICATION AGREEMENTIndemnification Agreement • August 31st, 2017 • Techpoint, Inc. • Semiconductors & related devices • Delaware
This Indemnification Agreement (the “Agreement”), is dated as of , 20 , between Techpoint, Inc., a Delaware corporation (the “Corporation”), and (“Indemnitee”).
TECHPOINT, INC. 2017 STOCK INCENTIVE PLAN (Adopted by the Board of Directors on August 10, 2017)Stock Incentive Plan • August 31st, 2017 • Techpoint, Inc. • Semiconductors & related devices • Delaware
Form of the Agreement][Translation of Japanese original text and For reference purposes only] New Share Purchase Agreement relating to Green Shoe Option for Techpoint, Inc. Beneficiary Certificates of Securities in TrustTechpoint, Inc. • August 31st, 2017 • Semiconductors & related devices
This agreement (the “Agreement”) is made and entered into by and between Techpoint, Inc. (the “Issuer”) and Mizuho Securities Co., Ltd (“Mizuho Securities” or the “Manager”) with respect to Green Shoe Option (as defined under (1) of Article 1 hereof) to be granted to the Underwriter by the Issuer.
Techpoint, Inc. Listed Foreign Stock Trust Beneficiary Interest Beneficiary Certificate Issuance Trust Agreement and Agreement regarding IssuerTechpoint, Inc. • August 31st, 2017 • Semiconductors & related devices
This Beneficiary Certificate Issuance Trust Agreement (this Beneficiary Certificate Issuance Trust Agreement and Agreement regarding Issuer are hereinafter collectively referred to as the “Agreement”) is entered into as of 31 August, 2017 by and among Mizuho Securities Co., Ltd. (the “Initial Settlor”), Mitsubishi UFJ Trust and Banking Corporation (“MUTB”) and The Master Trust Bank of Japan, Ltd. (“MTBJ”, and together with MUTB, the “Trustees”) subject to the provisions set forth below, and Techpoint, Inc. (the “Issuer”) hereby consents to the provisions set forth below.
Form of the Agreement][Translation of Japanese original text and For reference purposes only] Techpoint, Inc. New Share Underwriting AgreementShare Underwriting Agreement • August 31st, 2017 • Techpoint, Inc. • Semiconductors & related devices
Techpoint, Inc. (the “Issuer”), in connection with the listing of beneficiary certificates of a beneficiary-certificate-issuing trust whose trust assets are the shares of common stock of the Issuer on the Tokyo Stock Exchange, Inc (the “TSE”), with respect to 1,520,000 shares of common stock (the “Shares”) newly issued pursuant to the resolutions of the board of directors’ meetings held on August 30, 2017 (Pacific Standard Time) and September 8, 2017 (Pacific Standard Time), enters into this New Share Underwriting Agreement (this “Agreement”) with Mizuho Securities Co., Ltd. (the “Manager”) with respect to the underwriting and offering of the Shares and the beneficiary certificates of a beneficiary-certificate-issuing trust whose trust assets are the Shares (the “Beneficiary Certificates”; such offering, the “Offering”). Unless otherwise indicated, the times and dates referred to in this Agreement are in Japan time.
TECHPOINT, INC. SECOND AMENDED AND RESTATED INVESTORS’ RIGHTS AGREEMENT Dated as of April 30, 2014Investors’ Rights Agreement • August 31st, 2017 • Techpoint, Inc. • Semiconductors & related devices • California
THIS SECOND AMENDED AND RESTATED INVESTORS’ RIGHTS AGREEMENT (this “Agreement”) is made as of April 30, 2014 by and among Techpoint, Inc., a California corporation (the “Company”), Fumihiro Kozato (the “Founder”) and the investors listed on Schedule A hereto (each an “Investor” and collectively the “Investors”).
