EVERSPIN TECHNOLOGIES, INC., Issuer AND [TRUSTEE], Trustee INDENTURE Dated as of [•], 20__ Debt SecuritiesIndenture • November 3rd, 2017 • Everspin Technologies Inc • Semiconductors & related devices • New York
Contract Type FiledNovember 3rd, 2017 Company Industry JurisdictionINDENTURE, dated as of [•], 20 , among Everspin Technologies, Inc., a Delaware corporation (the “Company”), and [TRUSTEE], as trustee (the “Trustee”):
EVERSPIN TECHNOLOGIES, INC. AND , AS WARRANT AGENT FORM OF PREFERRED STOCK WARRANT AGREEMENT DATED AS OFWarrant Agreement • November 3rd, 2017 • Everspin Technologies Inc • Semiconductors & related devices • New York
Contract Type FiledNovember 3rd, 2017 Company Industry JurisdictionTHIS PREFERRED STOCK WARRANT AGREEMENT (this “Agreement”), dated as of [•], between EVERSPIN TECHNOLOGIES, INC., a Delaware corporation (the “Company”) and [•], a [corporation] [national banking association] organized and existing under the laws of [•] and having a corporate trust office in [•], as warrant agent (the “Warrant Agent”).
EVERSPIN TECHNOLOGIES, INC. AND , AS WARRANT AGENT FORM OF DEBT SECURITIES WARRANT AGREEMENT DATED AS OFWarrant Agreement • November 3rd, 2017 • Everspin Technologies Inc • Semiconductors & related devices • New York
Contract Type FiledNovember 3rd, 2017 Company Industry JurisdictionTHIS DEBT SECURITIES WARRANT AGREEMENT (this “Agreement”), dated as of [•], between EVERSPIN TECHNOLOGIES, INC., a Delaware corporation (the “Company”) and [•], a [corporation] [national banking association] organized and existing under the laws of [•] and having a corporate trust office in [•], as warrant agent (the “Warrant Agent”).