SYNDICATED LOAN AGREEMENT among J-DEVICES CORPORATION as Borrower SUMITOMO MITSUI BANKING CORPORATION as Arranger DEVELOPMENT BANK OF JAPAN INC. as Co- Arranger SUMITOMO MITSUI BANKING CORPORATION as Agent and SUMITOMO MITSUI BANKING CORPORATION AND...Syndicated Loan Agreement • July 19th, 2018 • Amkor Technology, Inc. • Semiconductors & related devices • Tokyo
This Agreement is made as of July 13, 2018, among J-DEVICES CORPORATION, as the borrower (the “Borrower”) and the financial institutions set out in the lenders column of Schedule 1 as the lenders (the ”Lenders”, each a “Lender”), and the Sumitomo Mitsui Banking Corporation, as the agent (the “Agent”), as follows:
ContractGuaranty • July 19th, 2018 • Amkor Technology, Inc. • Semiconductors & related devices • Tokyo
GUARANTY This is an English translation of the original Japanese text and is for the convenience purpose only, and, therefore, in case of any discrepancy or conflict between the original Japanese text of this Guaranty and this translation, the former shall always prevail. Date: July 13, 2018 (Lenders) Sumitomo Mitsui Banking Corporation Development Bank of Japan Inc. Sumitomo Mitsui Trust Bank, Limited The Oita Bank, Ltd. The Bank of Fukuoka, Ltd. Debtor Address Name (Do Not Sign Here) (Seal) Joint and Several Guarantor Address 2045 East Innovation Circle, Tempe, AZ 85284, the United States of America Name Amkor Technology, Inc. (Do Not Sign Here) Name: Title: The Joint and Several Guarantor shall be jointly and severally liable with the Debtor (if there is more than one Joint and Several Guarantor, then each of the Joint and Several Guarantors shall be jointly and severally liable with each other and with the Debtor) with respect to the following obligation owed by the Debtor to the a
LOAN AND SECURITY AGREEMENT Dated as of July 13, 2018 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD., and CERTAIN OF ITS SUBSIDIARIES OR AFFILIATES PARTY HERETO as Borrowers BANK OF AMERICA, N.A., as Agent DBS BANK LTD., as Documentation Agent and BANK...Loan and Security Agreement • July 19th, 2018 • Amkor Technology, Inc. • Semiconductors & related devices • New York
THIS LOAN AND SECURITY AGREEMENT is dated as of July 13, 2018, among AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD., a company incorporated under the laws of Singapore (“Amkor Singapore”) and other entities now or hereafter joined hereto as borrowers (together with Amkor Singapore, each a “Borrower” and collectively, the “Borrowers”), the financial institutions (which are qualified licensed money lenders under the laws of Singapore) party to this Agreement from time to time as Lenders, and BANK OF AMERICA, N.A., a national banking association (“Bank of America”), as agent for the Lenders (in such capacity, “Agent”).
GUARANTY AND SECURITY AGREEMENT Dated as of July 13, 2018 AMKOR TECHNOLOGY INC., and CERTAIN OTHER ENTITIES PARTY HERETO FROM TIME TO TIME, as Guarantors BANK OF AMERICA, N.A., as AgentGuaranty and Security Agreement • July 19th, 2018 • Amkor Technology, Inc. • Semiconductors & related devices • New York
THIS GUARANTY AND SECURITY AGREEMENT (this “Agreement”) is dated as of July 13, 2018, among AMKOR TECHNOLOGY, INC., a Delaware corporation (“Parent”), and other entities now or hereafter joined hereto as guarantors (together with Parent, each a “Guarantor” and collectively, the “Guarantors”), and BANK OF AMERICA, N.A., a national banking association (“Bank of America”), as agent for the Lenders under the below referenced Loan Agreement (in such capacity, “Agent”).
