CREDIT AGREEMENT dated as of October 25, 2018, among RESIDEO TECHNOLOGIES, INC., as Holdings, RESIDEO HOLDING INC., as U.S. HoldCo 1, RESIDEO INTERMEDIATE HOLDING INC., as U.S. HoldCo 2, RESIDEO FUNDING INC., as Borrower, The Lenders and Issuing Banks...Credit Agreement • October 29th, 2018 • Resideo Technologies, Inc. • Wholesale-hardware • New York
CREDIT AGREEMENT dated as of October 25, 2018 (this “Agreement”), among RESIDEO TECHNOLOGIES, INC., a Delaware corporation (“Holdings”), RESIDEO HOLDING INC., a Delaware corporation (“U.S. HoldCo 1”), RESIDEO INTERMEDIATE HOLDING INC., a Delaware corporation (“U.S. HoldCo 2”), RESIDEO FUNDING INC., a Delaware corporation (“Borrower”), the LENDERS and ISSUING BANKS party hereto and JPMORGAN CHASE BANK, N.A., as Administrative Agent.
