FORM OF INDEMNIFICATION AGREEMENTIndemnification Agreement • October 4th, 2021 • GLOBALFOUNDRIES Inc. • Semiconductors & related devices • Delaware
This INDEMNIFICATION AGREEMENT (“Agreement”), dated as of [DATE], is by and between GLOBALFOUNDRIES Inc., an exempted company incorporated in the Cayman Islands with limited liability (the “Company”) and [NAME OF INDEMNITEE] (the “Indemnitee”).
REGISTRATION RIGHTS AGREEMENT BY AND AMONG MUBADALA TECHNOLOGY INVESTMENT COMPANY, MTI INTERNATIONAL INVESTMENT COMPANY LLC,Registration Rights Agreement • October 4th, 2021 • GLOBALFOUNDRIES Inc. • Semiconductors & related devices • New York
This Registration Rights Agreement (the “Agreement”) is made, entered into and effective as of [•], 2021, by and among GLOBALFOUNDRIES Inc. (the “Company”), Mubadala Technology Investment Company (“MTIC”) and MTI International Investment Company LLC (together with MTIC, and their respective successors and Permitted Assignees (as defined below), the “Holders”).
ContractMaterials Supply Agreement • October 4th, 2021 • GLOBALFOUNDRIES Inc. • Semiconductors & related devices • New York
[***] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, HAS BEEN OMITTED BECAUSE IT IS BOTH (I) NOT MATERIAL AND (II) IS THE TYPE OF INFORMATION THE REGISTRANT TREATS AS PRIVATE OR CONFIDENTIAL.
SHAREHOLDER’S AGREEMENT by and among GLOBALFOUNDRIES Inc., Mubadala Technology Investment Company and MTI International Investment Company LLC Dated [•], 2021Shareholder Agreement • October 4th, 2021 • GLOBALFOUNDRIES Inc. • Semiconductors & related devices
This Shareholder’s Agreement is entered into on [•], 2021 by and among GLOBALFOUNDRIES Inc. (the “Company”), Mubadala Technology Investment Company (“MTIC”) and MTI International Investment Company LLC (together with MTIC, the “Holders”).
GLOBALFOUNDRIES INC. SHARE OPTION AGREEMENTShare Option Agreement • October 4th, 2021 • GLOBALFOUNDRIES Inc. • Semiconductors & related devices
THIS 2021 AMENDMENT to Share Option Agreements, including the Terms and Conditions of Share Options (“Option Agreements”), issued under the GLOBALFOUNDRIES Inc. 2018 Share Incentive Plan (the “Plan”) is entered into by GLOBALFOUNDRIES Inc. (the “Company”) as of September 2, 2021.
Addendum for 300mm RFSOI, PDSOI & Silicon Photonics Products to Materials Supply Agreement, dated April 25, 2017Materials Supply Agreement • October 4th, 2021 • GLOBALFOUNDRIES Inc. • Semiconductors & related devices
This Addendum for 300mm RFSOI, PDSOI & Silicon Photonics Products to GLOBALFOUNDRIES’ contract number 00037735.0 (the “2021 Addendum”) to the Materials Supply Agreement, dated April 25, 2017, GLOBALFOUNDRIES contract number 00037735.0, and as amended (the “Agreement”) is effective as of October 29, 2020 (the “Commencement Date”) by and between GLOBALFOUNDRIES U.S. Inc., a corporation organized under the laws of the State of Delaware, with its principal place of business at 2600 Great America Way, Santa Clara, California 95054, USA (“GF”) and SOITEC S.A., a Societe Anonyme organized under the laws of France with its principal office at Parc Technologique des Fontaines, Bernin 38926 Crolles Cedex (the “Supplier”). Both GF and Supplier are referenced herein as a Party or the Parties, as the case may be.
Dated September 3, 2021 GLOBALFOUNDRIES SINGAPORE PTE. LTD. as Company GLOBALFOUNDRIES INC. as Guarantor - and - ECONOMIC DEVELOPMENT BOARD as the Board TERM LOAN FACILITY AGREEMENTTerm Loan Facility Agreement • October 4th, 2021 • GLOBALFOUNDRIES Inc. • Semiconductors & related devices
