GUARANTEE AGREEMENT made by the GUARANTORS in favor of JPMORGAN CHASE BANK, N.A., as Administrative Agent Dated as of June 22, 2023Guarantee Agreement • June 26th, 2023 • On Semiconductor Corp • Semiconductors & related devices • New York
GUARANTEE AGREEMENT, dated as of June 22, 2023, made by each of the signatories identified on the signature pages hereto as a “Guarantor” (collectively, and together with any other entity that may become a party hereto as provided herein, the “Guarantors”), in favor of JPMORGAN CHASE BANK, N.A., as Administrative Agent (in such capacity, the “Administrative Agent”) for the banks and other financial institutions or entities (the “Lenders”) from time to time parties to the Credit Agreement, dated as of June 22, 2023 (as amended, amended and restated, supplemented or otherwise modified from time to time, the “Credit Agreement”), among ON SEMICONDUCTOR CORPORATION (the “Borrower”), certain other parties thereto, the Lenders and the Administrative Agent.
FORM OF] SECURITY AGREEMENT By ON SEMICONDUCTOR CORPORATION, as Borrower and the Guarantors and JPMORGAN CHASE BANK, N.A., as Administrative Agent Dated as of June 22, 2023Security Agreement • June 26th, 2023 • On Semiconductor Corp • Semiconductors & related devices • New York
This SECURITY AGREEMENT dated as of June 22, 2023 (as amended, restated, amended and restated, supplemented or otherwise modified from time to time in accordance with the provisions hereof, this “Agreement”), made by ON SEMICONDUCTOR CORPORATION, a Delaware corporation (the “Borrower”), and the Guarantors from time to time party hereto (the “Guarantors”), as pledgors and debtors (the Borrower, together with the Guarantors, in such capacities, the “Pledgors,” and each, a “Pledgor”), in favor of JPMORGAN CHASE BANK, N.A., in its capacity as administrative agent pursuant to the Credit Agreement (as hereinafter defined), as pledgee, assignee and secured party (in such capacities and together with any successors in such capacities, the “Administrative Agent”).
