TENDER AND SUPPORT AGREEMENTTender and Support Agreement • August 7th, 2023 • Sequans Communications • Semiconductors & related devices • Delaware
THIS TENDER AND SUPPORT AGREEMENT (this “Agreement”) is entered into as of August [•], 2023, by and between Renesas Electronics Corporation, a Japanese corporation (“Parent”) and [•] (“Shareholder”).
MEMORANDUM OF UNDERSTANDING BY AND BETWEEN RENESAS ELECTRONICS CORPORATION AND SEQUANS COMMUNICATIONS S.A. DATED AS OF AUGUST 4, 2023Tender and Support Agreement • August 7th, 2023 • Sequans Communications • Semiconductors & related devices • Delaware
This Memorandum of Understanding (this “MoU”) is made and entered into as of August 4, 2023, by and between Renesas Electronics Corporation, a Japanese corporation (“Parent”) and Sequans Communications S.A., a société anonyme organized under the laws of France (the “Company”). Parent and the Company are each sometimes referred to individually as a “Party” and collectively as the “Parties.”
