0001193125-24-059278 Sample Contracts

CREDIT AND SECURITY AGREEMENT among TRANSPHORM, INC., as Borrower, TRANSPHORM TECHNOLOGY, INC., as Guarantor, RENESAS ELECTRONICS AMERICA INC., as Lender Dated as of March 1, 2024

Credit and Security Agreement • March 5th, 2024 • Transphorm, Inc. • Semiconductors & related devices • New York

• Contract Type
  Credit and Security Agreement
• Filed
  March 5th, 2024
• Company
  Transphorm, Inc.
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

CREDIT AND SECURITY AGREEMENT, dated as of March 1, 2024, among TRANSPHORM, INC., a Delaware corporation (“Borrower”), TRANSPHORM TECHNOLOGY, INC., a Delaware corporation (“Guarantor”), and RENESAS ELECTRONICS AMERICA INC., a California corporation, as lender (together with its successors and assigns, “Lender”).