CREDIT AGREEMENT dated as of April 23, 2024 among QORVO, INC., as the Borrower, BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer, THE OTHER LENDERS PARTY HERETO, and BMO BANK, N.A., CITIBANK, N.A., MORGAN STANLEY SENIOR...Credit Agreement • April 26th, 2024 • Qorvo, Inc. • Semiconductors & related devices • New York
Contract Type FiledApril 26th, 2024 Company Industry JurisdictionThis CREDIT AGREEMENT is entered into as of April 23, 2024 among QORVO, INC., a Delaware corporation (the “Borrower”), the Lenders (defined herein) and BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer.