s/ signatures of the bank’s team member, team manager and deputy general manager of KDB Loan Agreement Date: March 26, 2024Loan Agreement • May 10th, 2024 • MAGNACHIP SEMICONDUCTOR Corp • Semiconductors & related devices
The Bank shall explain the important contents of this loan agreement (the “Agreement”) to the parties involved in the Agreement and deliver all contract documents, including the Bank’s General Terms and Conditions for Credit Transactions (for corporations), a copy of this Agreement, and the corporate loan product description.
KUN- MORTGAGE AGREEMENT Date: March 26, 2024Mortgage Agreement • May 10th, 2024 • MAGNACHIP SEMICONDUCTOR Corp • Semiconductors & related devices
The Bank shall explain all the material terms of this Agreement and shall deliver a copy of the General Terms and Conditions for Credit Transactions and this Agreement, to the Mortgagor.
