0001193805-13-000647 Sample Contracts

MARCH 2013 OFFERING LOCK-UP LETTER
Philips Pension Trustees LTD • March 14th, 2013 • Semiconductors & related devices

The undersigned understands that you, as the Underwriters (as defined below) or, if applicable, as representatives of the several Underwriters (the “Representatives”), propose to enter into an Underwriting Agreement (the “Underwriting Agreement”) with NXP Semiconductors N.V., a public company with limited liability (naamloze vennootschap) formed in The Netherlands (the “Company”) and certain shareholders of the Company named in Schedule I of the Underwriting Agreement (the “Selling Shareholders”), providing for the public offering (the “Public Offering”) by the Underwriter or the several Underwriters, as the case may be, named in Schedule II of the Underwriting Agreement (the “Underwriters”) of the ordinary shares, par value €0.20 per share, of the Company, to be sold by the Selling Shareholders (the “Shares”).

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MARCH 2013 UNDERWRITING AGREEMENT
Underwriting Agreement • March 14th, 2013 • Philips Pension Trustees LTD • Semiconductors & related devices • New York

The undersigned understands that you, as the Underwriters (as defined below) or, if applicable, as representatives of the several Underwriters (the “Representatives”), propose to enter into an Underwriting Agreement (the “Underwriting Agreement”) with NXP Semiconductors N.V., a public company with limited liability (naamloze vennootschap) formed in The Netherlands (the “Company”) and certain shareholders of the Company named in Schedule I of the Underwriting Agreement (the “Selling Shareholders”), providing for the public offering (the “Public Offering”) by the Underwriter or the several Underwriters, as the case may be, named in Schedule II of the Underwriting Agreement (the “Underwriters”) of the ordinary shares, par value €0.20 per share, of the Company, to be sold by the Selling Shareholders (the “Shares”).

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