Loan AgreementLoan Agreement • May 2nd, 2022 • Rentberry Inc. • Services-computer processing & data preparation
This Loan Agreement (hereinafter referred to as the “Agreement”) is entered into as of 15 September 2021, by and between Oleksiy Lyubynskyy, with a mailing address of XXXXXXXXXX (hereinafter referred to as the “Shareholder”) and Rentberry, Inc., with a mailing address of 201 Spear Street, Suite 1100, San Francisco, CA 94105 (hereinafter referred to as the “Corporation”), collectively referred to as the “Parties,” both of whom agree to be bound by this Agreement.
