HANRYU HOLDINGS, INC.Hanryu Holdings, Inc. • July 10th, 2023 • Services-computer programming, data processing, etc. • Delaware
This agreement (the “Agreement”) is entered into effective May 31, 2023 by and between Hanryu Holdings, Inc., a Delaware corporation (the “Company”) and [AUTHORIZED PERSON], a natural person (the “Subscriber”). Pursuant to the terms hereof, the Company hereby accepts the offer the Subscriber has made to purchase 760,000 shares of the Company’s common stock $0.001 par value per share (the “Shares”), for a Purchase Price (as defined in Section 1.1) of $10.00 per share.
Hanryu Bank Co., Ltd. The 12th Bearer Separate Privately Placed Bond with Warrant Underwriting AgreementUnderwriting Agreement • July 10th, 2023 • Hanryu Holdings, Inc. • Services-computer programming, data processing, etc.
Hanryu Bank Co., Ltd. (hereinafter referred to as “Issuing Company”) has concluded the underwriting agreement (hereinafter referred to as “This Agreement”) with Changhyuk Kang and Donghoon Park (hereinafter referred to as “Underwriter” or “Debenture Holder”) for the 12th bearer separate privately placed bond (hereinafter referred to as “This Bond”) with the total face value of KRW 1,300,000,000 issued on July 1, 2021, from the resolution of the board of directors held on July 1, 2021.
Bond, Stock, and Management Right Transfer ContractHanryu Holdings, Inc. • July 10th, 2023 • Services-computer programming, data processing, etc.
This bond, stock, and management right transfer contract (hereinafter referred to as “This Contract”) was concluded by the following parties as of June 30, 2021.
Contract of acquisition of bond with warrantHanryu Holdings, Inc. • July 10th, 2023 • Services-computer programming, data processing, etc.
Real Estate (Studio) Monthly Rent AgreementHanryu Holdings, Inc. • July 10th, 2023 • Services-computer programming, data processing, etc.
Hanryu Bank Co., Ltd. The 11th Bearer Separate Privately Placed Bond with Warrant Underwriting AgreementHanryu Holdings, Inc. • July 10th, 2023 • Services-computer programming, data processing, etc.
Hanryu Bank Co., Ltd. (hereinafter referred to as “Issuing Company”) has concluded the underwriting agreement (hereinafter referred to as “This Agreement”) with Midas AI Co., Ltd. (hereinafter referred to as “Underwriter” or “Debenture Holder”) for the 11th bearer separate privately placed bond (hereinafter referred to as “This Bond”) with the total face value of KRW 4,500,000,000 issued on July 2, 2021, from the resolution of the board of directors held on July 2, 2021.
