0001227025-18-000009 Sample Contracts

SEPARATION AGREEMENT
Separation Agreement • March 9th, 2018 • Neophotonics Corp • Semiconductors & related devices • California
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Term Loan Agreement (850,000,000 yen) Borrower: NeoPhotonics Semiconductors GK Arranger and Agent: The Bank of Tokyo-Mitsubishi UFJ, Ltd Lender: The Bank of Tokyo-Mitsubishi UFJ, Ltd.The Yamanashi Chuo Bank, Ltd.[ ] January 24, 2018
Loan Agreement • March 9th, 2018 • Neophotonics Corp • Semiconductors & related devices

NeoPhotonics Semiconductors GK (the "Borrower"), the financial institution listed in the "Lender" column in Table 1 annexed to the Agreement (financial institutions are referred to as "Lender" hereafter), and The Bank of Tokyo-Mitsubishi UFJ, Ltd. in its capacity as the Agent (the "Agent") agree as follows ("the Agreement") as of January 24, 2018.

NeoPhotonics Corporation Amendment to Retention Agreement
Amendment to Retention Agreement • March 9th, 2018 • Neophotonics Corp • Semiconductors & related devices • California

This Amendment to Retention Agreement (this “Amendment”) is made and entered into by and between Elizabeth Eby (the “Employee”) and NeoPhotonics Corporation, a Delaware corporation (the “Company”), effective as of November 6, 2017.

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