SEPARATION AGREEMENTSeparation Agreement • March 9th, 2018 • Neophotonics Corp • Semiconductors & related devices • California
Contract Type FiledMarch 9th, 2018 Company Industry Jurisdiction
Term Loan Agreement (850,000,000 yen) Borrower: NeoPhotonics Semiconductors GK Arranger and Agent: The Bank of Tokyo-Mitsubishi UFJ, Ltd Lender: The Bank of Tokyo-Mitsubishi UFJ, Ltd.The Yamanashi Chuo Bank, Ltd.[ ] January 24, 2018Loan Agreement • March 9th, 2018 • Neophotonics Corp • Semiconductors & related devices
Contract Type FiledMarch 9th, 2018 Company IndustryNeoPhotonics Semiconductors GK (the "Borrower"), the financial institution listed in the "Lender" column in Table 1 annexed to the Agreement (financial institutions are referred to as "Lender" hereafter), and The Bank of Tokyo-Mitsubishi UFJ, Ltd. in its capacity as the Agent (the "Agent") agree as follows ("the Agreement") as of January 24, 2018.
NeoPhotonics Corporation Amendment to Retention AgreementAmendment to Retention Agreement • March 9th, 2018 • Neophotonics Corp • Semiconductors & related devices • California
Contract Type FiledMarch 9th, 2018 Company Industry JurisdictionThis Amendment to Retention Agreement (this “Amendment”) is made and entered into by and between Elizabeth Eby (the “Employee”) and NeoPhotonics Corporation, a Delaware corporation (the “Company”), effective as of November 6, 2017.