SEPARATION AGREEMENT AND GENERAL RELEASESeparation Agreement and General Release • October 5th, 2006 • Ddi Corp • Printed circuit boards • California
Contract Type FiledOctober 5th, 2006 Company Industry JurisdictionThis Separation Agreement and General Release (this “Agreement”) is entered into on October 2, 2006 by and between Brad Tesch, an individual (the “Executive”), and DDi Corp., a Delaware corporation, on behalf of itself and all of its subsidiaries (collectively, “the Company”).
DDi Corp. Letterhead]Asset Purchase Agreement • October 5th, 2006 • Ddi Corp • Printed circuit boards
Contract Type FiledOctober 5th, 2006 Company IndustryReference is made to that certain Asset Purchase Agreement (the “Asset Purchase Agreement”), dated August 8, 2006, among VMS, LLC (“VMS”), VERITEK Manufacturing Services, LLC, Dynamic Details Incorporated, Silicon Valley (“DDiSV”) and Dynamic Details, Inc. (“DDi”), Capitalized terms used but not defined herein have the meanings set forth in the Asset Purchase Agreement.