Exhibit 10.4 SECURITY AGREEMENT ------------------ This is a Security Agreement between Debtor and Secured Party identified below dated the 13 day of January, 2006. Debtor: GLOBAL TECHNOLOGY COMPONENTS, LLC ------ 3103 42nd Ave., E., Bradenton, FL...Security Agreement • January 25th, 2006 • Telesis Technology Corp • Semiconductors & related devices • Florida
Exhibit 10.3 GUARANTY AGREEMENTGuaranty Agreement • January 25th, 2006 • Telesis Technology Corp • Semiconductors & related devices • Florida
THIS AGREEMENT is made this 13 day of January, 2006, between TELESIS ---- TECHNOLOGY CORPORATION, a Florida corporation, doing business as TELESIS COMMERCIAL PRODUCTS DIVISION, Owner of the business assets located at 1611 12th St. E., Unit B.,...Indemnification Agreement • January 25th, 2006 • Telesis Technology Corp • Semiconductors & related devices
In consideration of the purchase of the business assets of Seller by Buyer, the Seller agrees to hold Buyer harmless, and to indemnify Buyer, against any and all claims, liens, debts, taxes, fines, penalties, causes of action and judgments arising or existing in connection with the business known as "TELESIS COMMERCIAL PRODUCTS DIVISION", from the inception of the business through the date of the closing. Included in this indemnification shall be the cost of reasonable attorneys fees and court costs should they be incurred by Buyer in their defense against any such claims, liens, debts, taxes, fines, penalties, causes of action or judgments.
Exhibit 10.5 COVENANT NOT TO COMPETE -----------------------Covenant Not to Compete • January 25th, 2006 • Telesis Technology Corp • Semiconductors & related devices • Florida
