CREDIT AGREEMENT Dated as of October 5, 2011 between HOKU CORPORATION as Borrower, and INDUSTRIAL AND COMMERCIAL BANK OF CHINA LIMITED, NEW YORK BRANCH as Lender Loan No. NYLA 2011016Credit Agreement • October 6th, 2011 • Hoku Corp • Miscellaneous electrical machinery, equipment & supplies • New York
This CREDIT AGREEMENT dated as of October 5, 2011 (as the same may be amended, restated or otherwise modified from time to time, the “Credit Agreement”) between HOKU CORPORATION, a Delaware corporation (the “Borrower”) and INDUSTRIAL AND COMMERCIAL BANK OF CHINA LIMITED, NEW YORK BRANCH (the “Lender”).
Reimbursement Agreement – Tianwei As of October 5, 2011Reimbursement Agreement • October 6th, 2011 • Hoku Corp • Miscellaneous electrical machinery, equipment & supplies • New York
