CREDIT AGREEMENT Dated as of November 30, 2011 between HOKU CORPORATION as Borrower, and INDUSTRIAL AND COMMERCIAL BANK OF CHINA LIMITED, NEW YORK BRANCH as LenderCredit Agreement • December 1st, 2011 • Hoku Corp • Miscellaneous electrical machinery, equipment & supplies • New York
Contract Type FiledDecember 1st, 2011 Company Industry JurisdictionThis CREDIT AGREEMENT dated as of November 30, 2011 (as the same may be amended, restated or otherwise modified from time to time, the “Credit Agreement”) between HOKU CORPORATION, a Delaware corporation (the “Borrower”) and INDUSTRIAL AND COMMERCIAL BANK OF CHINA LIMITED, NEW YORK BRANCH (the “Lender”).
Reimbursement Agreement – TianweiReimbursement Agreement • December 1st, 2011 • Hoku Corp • Miscellaneous electrical machinery, equipment & supplies • New York
Contract Type FiledDecember 1st, 2011 Company Industry Jurisdiction