0001445305-14-003896 Sample Contracts

MASTER SEPARATION AGREEMENT BY AND AMONG
Master Separation Agreement • September 10th, 2014 • Oclaro, Inc. • Semiconductors & related devices

THIS MASTER SEPARATION AGREEMENT (this “Agreement”) is entered into as of August 5, 2014, by and among OCLARO JAPAN, INC., a corporation organized under the laws of Japan, having its principal place of business at 4-1-55, Oyama, Chuo-ku, Sagamihara-shi, Kanagawa (“Transferor”), USHIO OPTO SEMICONDUCTORS, INC., a corporation organized under the laws of Japan, having its principal place of business at 2-6-1, Ohtemachi, Chiyoda-ku, Tokyo (“Transferee”) and USHIO, INC., a corporation organized under the laws of Japan, having its principal place of business at 2-6-1, Ohtemachi, Chiyoda-ku, Tokyo (“Guarantor”). Transferor, Transferee and, with respect to Article 10 only, Guarantor are each referred to herein as a “Party” and collectively as the “Parties.” Capitalized terms used and not otherwise defined in this Agreement have the meanings ascribed to such terms in Exhibit A.

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CONFIDENTIAL SEPARATION AGREEMENT AND RELEASE OF CLAIMS
Confidential Separation Agreement • September 10th, 2014 • Oclaro, Inc. • Semiconductors & related devices • California

This Confidential Separation Agreement and Release of Claims (the “Agreement”) is entered into as of May 30, 2014, by and between Oclaro, Inc., a Delaware corporation (“Company”), and Terence F. Unter (“Executive”). Company and Executive are sometimes referred to herein individually as a “Party” and collectively as the “Parties.”

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