REGISTRATION RIGHTS AGREEMENTRegistration Rights Agreement • December 13th, 2023 • Isun, Inc. • Semiconductors & related devices
This Registration Rights Agreement (this “Agreement”) is made and entered into as of December 12, 2023 between iSun, Inc., a Delaware corporation (the “Company”), and each of the several purchasers signatory hereto (each such purchaser, a “Holder” and, collectively, the “Holders”).
REVENUE LOAN AND SECURITY AGREEMENTRevenue Loan and Security Agreement • December 13th, 2023 • Isun, Inc. • Semiconductors & related devices
THIS REVENUE LOAN AND SECURITY AGREEMENT (as amended from time to time, this “Agreement”) is made as of December 12, 2023 (the “Effective Date”), by and among iSun, Inc., a Delaware corporation (“Company”), the parties listed under the heading “Guarantors” on the signature pages attached hereto (each, a “Guarantor,” collectively, the “Guarantors;” each of Company and each Guarantor are referred to herein as a “Company Entity,” and together as the “Company Entities”), and Decathlon Specialty Finance, LLC, a Delaware limited liability company (“Lender”).
LOCK-UP AGREEMENTLetter Agreement • December 13th, 2023 • Isun, Inc. • Semiconductors & related devices
Re: Letter Agreement by and among Anson Investments Master Fund LP (“AIMF”), Anson Easter Master Fund LP (“AEMF” and together with AIMF, the “Purchasers”), and iSun, Inc. (the “Company”) December 12, 2023 (the “Side Letter”).
December 12, 2023Letter Agreement • December 13th, 2023 • Isun, Inc. • Semiconductors & related devices • Delaware
Reference is hereby made to that certain (i) Letter Agreement and Notice re Optional Redemption, dated December 1, 2023 (the “Redemption Notice”), among Anson Investments Master Fund LP (“AIMF”), Anson East Master Fund LP (“AEMF”), and iSun, Inc. (the “Company”) and (ii) Payoff Letter, dated December 1, 2023, (the “Payoff Letter”), among the Company, AIMF, and AEMF. Capitalized terms used but not defined herein shall have the meanings given to them in the Redemption Notice or the Payoff Letter, as applicable. The Company, AEMF and AIMF hereby agree as follows.
