THIRD AMENDMENT TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • August 7th, 2019 • Everspin Technologies Inc • Semiconductors & related devices
THIS THIRD AMENDMENT TO LOAN AND SECURITY AGREEMENT (this “Amendment”) is entered into this 19th day of June 2019, by and between SILICON VALLEY BANK, a California corporation “Bank”), and EVERSPIN TECHNOLOGIES, INC., a Delaware corporation (“Borrower”).
