LOAN AND SECURITY AGREEMENT Dated as of August 6, 2014 MULTI-FINELINE ELECTRONIX SINGAPORE PTE. LTD., as Borrower and as a Guarantor CERTAIN FINANCIAL INSTITUTIONS, as Lenders and BANK OF AMERICA, N.A., as AgentLoan and Security Agreement • November 14th, 2014 • Multi Fineline Electronix Inc • Printed circuit boards • California
THIS LOAN AND SECURITY AGREEMENT is dated as of August 6, 2014, among MULTI-FINELINE ELECTRONIX SINGAPORE PTE. LTD., a Singapore company (“Borrower”), MULTI-FINELINE ELECTRONIX, INC., a Delaware corporation (“Holdings”), the financial institutions party to this Agreement from time to time as lenders (collectively, “Lenders”), and BANK OF AMERICA, N.A., a national banking association, as agent for the Lenders (“Agent”).
