and DEUTSCHE BANK TRUST COMPANY AMERICAS, as Trustee $750,000,000 3.875% SENIOR NOTES DUE 2026 $1,000,000,000 4.300% SENIOR NOTES DUE 2029 __________ SENIOR INDENTURE Dated as of June 18, 2019 __________NXP Semiconductors N.V. • July 30th, 2019 • Semiconductors & related devices • New York
INDENTURE dated as of June 18, 2019, among NXP B.V. (the “Company”), NXP Funding LLC, a Delaware limited liability company (“NXP Funding”) and NXP USA, Inc., a Delaware corporation (“NXP USA”, and together with NXP Funding and the Company, the “Issuers” and each an “Issuer”), the Parent (as defined herein) and Deutsche Bank Trust Company Americas, a New York banking corporation, as trustee (the “Trustee”).
GUARANTY RELATING TO THE CREDIT AGREEMENTCredit Agreement • July 30th, 2019 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
GUARANTY, dated as of June 11, 2019 (as amended, restated, amended and restated, supplemented and otherwise modified from time to time, this “Guaranty”), made by NXP Semiconductors N.V., with its corporate seat in Eindhoven, the Netherlands (“NXP Semiconductors”) and NXP USA, Inc., a Delaware corporation (“NXP USA” and, together with NXP Semiconductors and any other Subsidiary that becomes a party hereto as a Guarantor (in each case, unless and until such Person ceases to be a Guarantor in accordance with this Guaranty, individually, a “Guarantor” and, collectively, the “Guarantors”) and Barclays Bank PLC, as administrative agent (in such capacity, together with its successors in such capacity, the “Administrative Agent”) for the lenders from time to time party to the Credit Agreement (collectively, the “Lenders”).
REVOLVING CREDIT AGREEMENT dated as of June 11, 2019, among NXP B.V. and NXP FUNDING LLC, as the Borrowers, The Several Lenders From Time to Time Parties Hereto, Barclays Bank PLC, as Administrative Agent, and the Letter of Credit Issuers Barclays...Revolving Credit Agreement • July 30th, 2019 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
REVOLVING CREDIT AGREEMENT, dated as of June 11, 2019 (this “Agreement”), among NXP B.V. with its corporate seat in Eindhoven, the Netherlands (the “Company”), NXP FUNDING LLC, a Delaware limited liability company (the “Co-Borrower”), the financial institutions from time to time parties hereto (each a “Lender” and, collectively, the “Lenders”) and Barclays Bank PLC, as the Administrative Agent (in such capacity, together with its successors and permitted assigns in such capacity, the “Administrative Agent”).
