INDENTURE Dated as of January 15, 2016 Between MICROSEMI CORPORATION and THE GUARANTORS NAMED HEREIN and U.S. BANK NATIONAL ASSOCIATION, as Trustee 9.125% SENIOR NOTES DUE 2023Indenture • January 19th, 2016 • Microsemi Corp • Semiconductors & related devices • New York
Contract Type FiledJanuary 19th, 2016 Company Industry JurisdictionINDENTURE, dated as of January 15, 2016, between Microsemi Corporation, a Delaware corporation (the “Issuer,” as more fully set forth in Section 1.01), the initial Guarantors set forth in Schedule 1 hereto and U.S. Bank National Association, as Trustee.
CREDIT AGREEMENT among MICROSEMI CORPORATION as Borrower The Several Lenders from Time to Time Parties Hereto and MORGAN STANLEY SENIOR FUNDING, INC., as Administrative Agent and Collateral Agent Dated as of January 15, 2016 MORGAN STANLEY SENIOR...Credit Agreement • January 19th, 2016 • Microsemi Corp • Semiconductors & related devices • New York
Contract Type FiledJanuary 19th, 2016 Company Industry Jurisdiction
FIRST SUPPLEMENTAL INDENTURESupplemental Indenture • January 19th, 2016 • Microsemi Corp • Semiconductors & related devices • New York
Contract Type FiledJanuary 19th, 2016 Company Industry JurisdictionFirst Supplemental Indenture (this “Supplemental Indenture”), dated as of January 15, 2016, among Microsemi Corporation, a Delaware corporation (the “Issuer”), Microsemi Storage Solutions, Inc., a Delaware corporation (“MSS Inc.”), Microsemi Storage Solutions (U.S.), Inc., a Delaware corporation (“MSS US Inc.”), and Wintegra, Inc., a Delaware corporation (“Wintegra” and together with MSS Inc. and MSS US Inc., each, a “Guaranteeing Subsidiary” and collectively, the “Guaranteeing Subsidiaries”), and U.S. Bank National Association, as trustee under the Indenture referred to below (the “Trustee”).