Loan AgreementLoan Agreement • September 25th, 2015 • CGN Nanotech, Inc. • Wholesale-electrical apparatus & equipment, wiring supplies • Hong Kong
Contract Type FiledSeptember 25th, 2015 Company Industry JurisdictionThis Agreement is signed and entered in on 26 January, 2015 in Suite 2201, 22/F Malaysia Building, 50 Gloucester Road, Wanchai, Hong Kong (the “Agreement”).