TENTH AMENDMENT TO CREDIT AGREEMENTCredit Agreement • February 6th, 2023 • On Semiconductor Corp • Semiconductors & related devices • New York
Contract Type FiledFebruary 6th, 2023 Company Industry JurisdictionTENTH AMENDMENT TO CREDIT AGREEMENT, dated as of November 16, 2022 (the “Tenth Amendment”), among ON SEMICONDUCTOR CORPORATION, a Delaware corporation (the “Borrower”), the Subsidiary Guarantors party hereto, DEUTSCHE BANK AG NEW YORK BRANCH (“DBNY”), as administrative agent (in such capacity, and together with its successors and assigns in such capacity, the “Administrative Agent”) and DBNY, as collateral agent (in such capacity, and together with its successors and assigns in such capacity, the “Collateral Agent”) under the Credit Agreement referred to below (with capitalized terms used, but not defined, in this paragraph and the recitals below to be defined as provided in Section 1 below).
EMPLOYMENT AGREEMENTEmployment Agreement • February 6th, 2023 • On Semiconductor Corp • Semiconductors & related devices • Arizona
Contract Type FiledFebruary 6th, 2023 Company Industry JurisdictionThis EMPLOYMENT AGREEMENT (this “Agreement”), dated as of June 22, 2022 (the “Effective Date”), is entered into by and between Semiconductor Components Industries, LLC (the “Company”), a wholly owned subsidiary of ON Semiconductor Corporation, a Delaware Corporation (the “Parent”), and Robert Tong (“Executive”). Executive and the Company are individually referred to as a “Party” and together as the “Parties.” In consideration of the mutual covenants, promises, and obligations set forth herein, the Parties agree as follows: