BORROWER: SOLITRON DEVICES, INC., a Delaware corporation GUARANTOR: MICRO ENGINEERING, INC., a Florida corporation CONTINUING AND UNCONDITIONAL GUARANTYContinuing and Unconditional Guaranty • May 24th, 2024 • Solitron Devices Inc • Semiconductors & related devices • Florida
ContractMortgage, Assignment of Rents, Security Agreement and Fixture Filing • May 24th, 2024 • Solitron Devices Inc • Semiconductors & related devices • Florida
Prepared by and after recording return to: James L. Purcell, Jr. Stoneburner Berry Purcell & Campbell, P.A. 1031 LaSalle Street Jacksonville, Florida 32207
LOAN AGREEMENTLoan Agreement • May 24th, 2024 • Solitron Devices Inc • Semiconductors & related devices • Florida
This Loan Agreement, dated as of May 21, 2024, is entered into between BANK OF AMERICA, N.A. (the "Bank") and SOLITRON DEVICES, INC., a Delaware corporation (the "Borrower").
