CREDIT FACILITY AGREEMENTLetter of Authorization • October 13th, 2020 • Applied Optoelectronics, Inc. • Semiconductors & related devices
This Credit Facility Agreement (hereinafter the “Agreement”) is made by and between the undersigned (hereinafter the “Customer”) and Taishin International Bank (hereinafter the “Bank”). In consideration of the extension or continuation of current and future facilities of loans to the undersigned, and up to the maximum principal amount of (1.□NT$ ; 2.□$ in (currency); 3.þ NTD 100 million and USD 1 million), the Customer agrees to and the terms of the loans approved by the Bank and the following terms and conditions:
