Credit Granting Agreement No.: xxxxxxxxxxGranting Agreement • October 22nd, 2020 • Applied Optoelectronics, Inc. • Semiconductors & related devices • Hong Kong
Contract Type FiledOctober 22nd, 2020 Company Industry JurisdictionBased on Party B's application, Party A hereby agrees to provide Party B with a credit line. Party A and Party B have reached consensus on the following terms and have entered into this Credit Granting Agreement (“Agreement”) through sufficient mutual negotiation in accordance with the relevant laws and regulations.