Die Yield definition
Examples of Die Yield in a sentence
Price per good die shall be initially based on the wafer price divided by the average die yields for the previous six months (the "Die Yield") and shall be adjusted on the same basis every six months thereafter, subject to a floor equal to the Minimum Yield Criteria.
In the event that the Parties do not agree on an Agreed Die Yield for a given Quarter, the Agreed Die Yield for the previous Quarter shall apply.
The Agreed Die Yield for the first Quarter of the Initial Period is set forth on Exhibit G attached hereto.
The sole liability of Fujitsu for failure to attain the Agreed Die Yield in any Quarter shall be the Wafer Price Adjustment provided for in Section 6.2.1 below.
The Agreed Die Yield shall be revised and mutually agreed upon by the Parties every Quarter based on the actual NDW yields achieved by Fujitsu in the previous Quarter.
The Minimum Die Yield Rate, the Standard Die Yield Rate, the Probing Standard and the PCM Standard shall be reviewed occasionally after mutual consultation between the Parties so as to increase production efficiency of the Products by setting a specific target which shall be determined after mutual consultation between the Parties.
If the yield or defect density of the Wafers and/or any Wafer Lot for any Product are at or below the Minimum Die Yield (as defined in Attachment F) for such Product, LSI will have the right to reject the Wafers and/or the entire Wafer Lot, at no cost to LSI.
For the purpose of interpretation of the Die Yield Rate under this Section 8.1, the Die Yield Rate shall be based upon the number of non-defective chips and defective chips of the Products by the Probing Inspection which shall be conducted at the last process after the Manufacturing is completed, method of which shall be separately instructed by Panasonic and agreed by the Company.
The Minimum Die Yield for each Product will be initially calculated when [*] production Wafers for such Product have been manufactured at the G▇▇▇▇▇▇ Facilities (including Wafers manufactured prior to the Effective Date) and will be recalculated every [*] thereafter using the data from the just-ended [*] period; provided however, that no reduction in the Minimum Die Yield for a Product will be permitted.
Die Yield shall be based upon Historical Yield or Tower Yield by product.