Capitolato Tecnico
Capitolato Tecnico
PON "Ricerca e Innovazione 2014-2020" Avviso D.D. n. 424 del 28/02/2018 per la concessione di finanziamenti finalizzati al potenziamento di infrastrutture di ricerca, in attuazione dell'Azione II.1
PACK(PIR01_00021)
Potenziamento Appulo Campano di KM3NeT Fornitura di 504 rivelatori acustici (piezo)
PON "Ricerca e Innovazione 2014-2020" Avviso D.D. n. 424 del 28/02/2018 per la concessione di finanziamenti finalizzati al potenziamento di infrastrutture di ricerca, in attuazione dell'Azione II.1
CUP I11G18000190001 CIG 8376645222
Summary
1. Introduction 2
2. Object of the supply 2
3. Technical specifications 3
3.1. Cable specifications 3
3.2. Construction of the piezo-acoustic sensor housing 4
3.3. Electronics Specifications 8
3.4. Test procedure and required performance 9
4. Delivery schedule 11
5. Appendix 1 12
1. Introduction
The goal of this document is to provide the requirements, guidelines, acceptability criteria, supply times and methods and general conditions for the production of piezo-based acoustic sensors that the INFN-Napoli (hereinafter referred to as the client) intend to have built by a third party (hereinafter referred to as the supplier).
This document does not determine the commercial conditions of the supply (e.g. prices, payment methods, guarantees, penalties, obligations, etc.) for which reference should be made to the specific document.
2. Object of the supply
The object of this request is the supply of 504 piezo sensors for the realization of the DOMs (Digital Optical Module) needed to realise the DUs (Detection Units) to be deployed at the Capo Passero off-shore site for the upgrade of the KM3NeT Infrastructure.
Each DU line consists of 18 DOMs.
The DOM consists of a 17-inch diameter borosilicate glass sphere in which 31 photon detectors, called photomultipliers, are housed with data acquisition and processing electronics. The piezo sensors are used for the spatial localization of the DOMs during data acquisition by triangulation of an acoustic signal emitted by the base of the detector unit (DU).
The object of the supply is the realization of the electronics, the cable and the housing of 504 piezo-ceramic (acoustic) sensors that will be supplied to the winning company and the loading of the firmware, which will also be supplied, into the FPGA present in the electronics. In addition, the winning company will have to perform the functional verification tests as described below. The required production, therefore, includes:
1. Realization of the sensor connection cable according to the attached drawing.
2. Realization of the housing of the piezo-acoustic sensors according to the specifications in chapter 5 of this document.
3. Electronics design based on existing circuit diagrams that will be supplied to the winning company.
4. Loading the firmware into the FPGA.
5. Functional verification test of the sensors subject to the competition according to the following specifications.
Cleaning of the supplied piezo ceramics may be required.
3. Technical specifications
3.1.Cable specifications
The sensor connection cable must be made according to the following drawing:
3.2. Construction of the piezo-acoustic sensor housing
The sensor housing consists of a bronze screen consisting of two elements and an aluminium housing. Below are the drawings of the two screen components:
Both components must be made from a 0.150 mm foil of CW101C/CuBe2 R510.
Below is a drawing of the aluminium casing:
3.3. Electronics Specifications
The PCB of the sensor electronics must be made according to Starrflex multilayer technology, below is an image of the circuit and the list of components. All gerber files and the circuit diagram will be provided to the winning company.
Below is the list of components, more details are available in All_G:
Quantity | Montage | Comment | Description |
6 | SMD | X5R 10uF 10V 0402 | Capacitor Ceramic X5R, 20% -55...+85°C |
13 | SMD | X7R 100nF 16V 0402 | Capacitor Ceramic X7R, 10% -55...+125°C |
1 | SMD | C0G 100pF 50V 0402 | Capacitor Ceramic C0G/NP0, 5% -55...+125°C |
1 | SMD | C0G 33pF 50V 0402 | Capacitor Ceramic C0G/NP0, 5% -55...+125°C |
9 | SMD | X5R 1uF 10V 0402 | Capacitor Ceramic X5R, 10% -55...+85°C |
2 | SMD | X5R 220nF 10V 0402 | Capacitor Ceramic X5R, 10% -55...+85°C |
1 | SMD | C0G 68pF 50V 0402 | Capacitor Ceramic C0G/NP0, 5% -55...+125°C |
1 | SMD | X7R 1uF 16V 0603 | Capacitor Ceramic X7R, 10% -55...+125°C |
1 | SMD | C0G 680pF 50V 0402 | Capacitor Ceramic C0G/NP0, 5% -55...+125°C |
1 | SMD | C0G 3.3pF 50V 0402 | Capacitor Ceramic C0G/NP0, ±0.1pF -55...+125°C |
1 | SMD | AP2210K-3.3TRG1 SOT23/5 | IC Regulator Voltage LDO, 3.3V 300mA, Low Noise 13.2Vin |
1 | SMD | SiT8008B 24.576MHz 3.2x2.5 | IC Clock Osc, 50ppm 3V3 MEMS |
1 | SMD | MCP1501T-25 SOT23/6 | IC Linear, Reference Voltage, 2.5V 0.1% 50ppm/°C Low Noise |
1 | SMD | ADS127L01I TQFP32 | IC Linear, ADC Delta-Sigma, 24-Bit 1-Channel 512KSps |
1 | SMD | LCMXO2-1200HC-6SG32I | IC FPGA, Lattice MachXO2 3V3 1280LUT 21IO |
1 | SMD | ADA4841-2YRMZ MSOP8 | IC Linear, OPAMP Bipolar, Dual 12V 80MHz RRO |
1 | SMD | LT6230IS6-10 SOT23/6 | IC Linear, OPAMP Bipolar, Single 12.6V 1450MHz 250V/us RRO |
1 | THT | WR-WTB 1x04 V RM1.50 | Connector Rectangular RM 1.50 Male, 4-pos Single Row 180°, Shrouded |
1 | THT | WR-WTB 1x02 V RM1.50 | Connector Rectangular RM 1.50 Male, 2-pos Single Row 180°, Shrouded |
1 | THT | WR-FPC 08 V RM0.50 | Connector Rectangular RM 2.00 Male, 5-pos Single Row 180°, Shrouded |
6 | SMD | WE-CBF 600Z 1.0A 0603 | Inductor Ferrite, 600Z @ 100MHz 1.0A 0.2R |
1 | PIEZO | Piezo 17,9 x 12,0 (DxL) | |
6 | SMD | R 22R 1% 0402 | Resistor Metal Film, 63mW 100ppm/K -55...+125°C |
3 | SMD | R 3k3 1% 0402 | Resistor Metal Film, 63mW 100ppm/K -55...+125°C |
12 | SMD | R 150R 1% 0402 | Resistor Metal Film, 63mW 100ppm/K -55...+125°C |
2 | SMD | R 1k0 1% 0402 | Resistor Metal Film, 63mW 100ppm/K -55...+125°C |
1 | SMD | R 60k4 1% 0402 | Resistor Metal Film, 63mW 100ppm/K -55...+125°C |
3 | SMD | R 1k5 1% 0402 | Resistor Metal Film, 63mW 100ppm/K -55...+125°C |
1 | SMD | R 750R 1% 0402 | Resistor Metal Film, 63mW 100ppm/K -55...+125°C |
2 | SMD | R 2k7 1% 0402 | Resistor Metal Film, 63mW 100ppm/K -55...+125°C |
2 | SMD | R 3k00 0.1% 0402 | Resistor Metal Film, 63mW 25ppm/K -55...+125°C |
1 | SMD | R 4k3 1% 0402 | Resistor Metal Film, 63mW 100ppm/K -55...+125°C |
1 | SMD | R 100R 1% 0402 | Resistor Metal Film, 63mW 100ppm/K -55...+125°C |
1 | SMD | R 4k7 1% 0402 | Resistor Metal Film, 63mW 100ppm/K -55...+125°C |
1 | SMD | R 100k 1% 0402 | Resistor Metal Film, 63mW 100ppm/K -55...+125°C |
1 | SMD | EBX28V 33R 5% | Resistor Array, 4x 63mW isolated, convex Contact |
1 | SMD | RA EBX28V 10K 5% | Resistor Array, 4x 63mW isolated, konvex Contact |
1 | SMD | 2SK3557 SOT23 | Transistor JFET N-Ch, 15V 50mA 35mS, Low Noise |
3.4. Test procedure and required performance
The test procedure to be performed on all sensors is described in the file attached to the following specifications and named: KM3NeT CALIB_2020_004-piezo_Var2_testprocedure_lahmann_v02.pdf.
In order to be accepted, the sensors must meet the following noise requirements:
Noise must be below -120 dB re 1 V/√𝐻𝑧 in the range from 10 to 70 kHz. Single spikes at specific frequencies, as the two spikes near 45kHz in the figure below, are not problematic as long as their number is below 10.
And the following performance in terms of spectral response: When tested as described in the attached file KM3NeT CALIB_2020_004-piezo_Var2_testprocedure_lahmann_v02.pdf, the excitation of the piezo sensor with an external piezo ceramics at frequencies 15, 25, 30, 40, 50, 60 and 70 kHz, the signal of the piezo sensor must be above the red broken line shown in the figure below. This line connects the value of -80 db re 1 V/√𝐻𝑧 at 10 kHz and -62 db re 1 V/√𝐻𝑧 at 70 kHz .
Comment: The requirements for the sensitivity are very difficult to specify since they depend on the test conditions. We provided a specification in dB re V/μPa to the company but this you cannot easily test in the lab. Then the voltages of the test were set by basically looking at what the amplitude for a sensor with the specified sensitivity in V/μPa yields. I do not see any better way of specifying the sensitivity requirement.
When the 510 sensors of the current order are produced, I can provide you with the test setup, so you can look at it for yourself and more easily answer potential questions by the bidding companies.
The complete test setup including software will be provided to the winning company. The setup produces wav-files that will be analysed by INFN-Napoli. Online displays allow the winning company to judge the result of the test. Comment: The code for the analysis is written In C++ and involves root and it is unlikely that is is easily brought to work on a Windows-based PC. Then I’m running a script on the output of the C++ file that creates a latex-file from which a PDF is created. This was never really foreseen to be done by anybody except for myself. What I can try to do is to come up with a python-script that runs a simple pass/fail test on the recorded wav-file.
4. Delivery schedule and payments
After a start-up phase of 3 months (to be agreed upon) sensors shall be delivered at a rate of 100 pcs/month. The fifth delivery should contain 104 piezos to reach the total amount of 504.
In any case the furniture should be completed within 10 months the signature of the contract.
The Director of Contract Execution DEC) and the RUP for approval, following verification of the terms and conditions will issue the certificate for the steps of payment (100 pcs/month), which authorizes the company to the issue of the relevant invoice corresponding to the delivered material.
Payments will then be made in accordance with the terms and conditions described in the Terms and Conditions set out at
basis of the race. Appendix 1
Il RUP
(xxxx. Xxxxxxxx Xxxxxxxxx)