Riding heat sink system Clause Samples

Riding heat sink system. The heat sink system for CFP modules introduces the “Riding heat sink system” whereby the heat sinks are attached on rails of a host card. As the CFP is inserted, the heat sink “rides” on top of the CFP module. This system allows the heat of the CFP module to be dissipated to the heat sink. The bottom of heat sink which “rides” on top of the CFP module shall have a low friction high thermal conductivity interface. The Riding heat sink system enables system venders to design a common CFP port with a single faceplate aperture size. The optimum heat sink may be designed to accommodate the thermal management of various line card designs depending on the variation of the power class (defined in Table 8-1), line card dimension, module port number and air flow direction. Below are examples. 1) For power class 1 (<8W, no riding heat sink is shown) Module Host PCB Rails 2) For power class 2, 3, 4 (>8W, riding heat sink strongly recommended) Heat sink Module Host PCB Module Heat sink Taller type of heat sink Wider type of heat sink Longer type of heat sink Rails Module Heat sink Host PCB Module Heat sink Module Heat sink Rails Module Heat sink Host PCB Heat sink Host PCB Rails Host PCB Module Rails