Exhibit 4.2 EMPLOYMENT AGREEMENT This Employment Agreement ("Agreement"), made this 27th day of October, 2003, is entered into between Besi USA Inc., a Delaware corporation, with its principal place of business at Besi Die Handling at 10 Tinker...Employment Agreement • April 3rd, 2006 • Be Semiconductor Industries Nv • Semiconductors & related devices • New Hampshire
Exhibit 4.3 AGREEMENT FOR SERVICES (PURSUANT TO BOOK 7, TITLE 7, SECTION 1 OF THE DUTCH CIVIL CODE (OVEREENKOMST VAN OPDRACHT)) THE UNDERSIGNED: 1. The public limited company BE SEMICONDUCTOR INDUSTRIES N.V. (hereinafter to be called: "the Client"),...Agreement for Services • April 3rd, 2006 • Be Semiconductor Industries Nv • Semiconductors & related devices
Exhibit 4.1 BE SEMICONDUCTOR INDUSTRIES EMPLOYMENT AGREEMENT THE UNDERSIGNED: 1. The public limited company BE SEMICONDUCTOR INDUSTRIES N.V. (hereinafter to be called: "the Employer"), having its registered office and principal place of business in...Employment Agreement • April 3rd, 2006 • Be Semiconductor Industries Nv • Semiconductors & related devices
