Ase Test LTD Sample Contracts

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BETWEEN
Sale and Purchase Agreement • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
SERVICE AGREEMENT
Service Agreement • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
AGREEMENT
Commission Agreement • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
Between
Sub-Lease Agreement • June 30th, 2004 • Ase Test LTD • Semiconductors & related devices
AND
Sub-Lease • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
SERVICE AGREEMENT
Service Agreement • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
Exhibit 4(h) Land Lease Agreement
Land Lease Agreement • June 30th, 2004 • Ase Test LTD • Semiconductors & related devices
RECITALS
Sublease Agreement • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
Exhibit 4(t) Plant Building Lease Agreement
Plant Building Lease Agreement • June 30th, 2004 • Ase Test LTD • Semiconductors & related devices
ARTICLE 1
Sublease Agreement • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
COMMISSION AGREEMENT
Commission Agreement • June 19th, 2006 • Ase Test LTD • Semiconductors & related devices
COMMISSION AGREEMENT
Commission Agreement • June 19th, 2006 • Ase Test LTD • Semiconductors & related devices
COMMISSION AGREEMENT
Commission Agreement • June 19th, 2006 • Ase Test LTD • Semiconductors & related devices
Land Lease Agreement
Land Lease Agreement • June 19th, 2006 • Ase Test LTD • Semiconductors & related devices

This Land Lease Agreement (the “Agreement”) made and entered into by and between the Lessor, Nantze Export Processing Zone Administration of Ministry of Economic Affairs (hereinafter referred to as “Party A”) and the Lessee, ASE Test Inc. (hereinafter referred to as “Party B”).

ASSET PURCHASE AGREEMENT by and among FLEXTRONICS MANUFACTURING (M) SDN BHD as Buyer, ASE ELECTRONICS (M) SDN. BHD. as Company Dated as of October 3, 2005
Asset Purchase Agreement • June 19th, 2006 • Ase Test LTD • Semiconductors & related devices

THIS ASSET PURCHASE AGREEMENT (the “Agreement”) is made as of October 3, 2005 (the “Agreement Date”), by and among Flextronics Manufacturing (M) Sdn Bhd (Company Registration No. 206755A, a Malaysia corporation (the “Buyer”) with its registered address at Level 14, Uptown 1, 1 Jalan SS21/58, Damansara Uptown, 47400 Petaling Jaya, Selangor Darul Ehsan, Malaysia and ASE Electronics (M) Sdn. Bhd. (Company registration No. 212592-H), a Malaysia corporation with its place of business at Phase 4, Bayan Lepas Free Industrial Zone, 11900 Penang, Malaysia and its registered address at Suite 2-1, 2nd Floor, Menara Penang Garden, No.42A Jalan Sultan Abmad Shah, 10050 Penang, Malaysia (the “Company”).

COMMISSION AGREEMENT
Commission Agreement • June 19th, 2006 • Ase Test LTD • Semiconductors & related devices
English Translation] SYNDICATED LOAN AGREEMENT BORROWER: ADVANCED SEMICONDUCTOR ENGINEERING INC. AGENT: CITIBANK, N.A., TAIPEI BRANCH AMOUNT: NT$24,750,000,000 Date: March 3, 2008
Syndicated Loan Agreement • March 6th, 2008 • Ase Test LTD • Semiconductors & related devices

WHEREAS, to facilitate the Borrower’s funding needs in respect of the Acquisition (defined below), the Borrower has requested the Arrangers to arrange, and the Banks to extend to the Borrower, a term loan facility in an aggregate principal amount of NT$24,750,000,000 as more detailed described below (the “Facility”); and

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