EXHIBIT 1 COMMON STOCK PURCHASE AGREEMENT by and between PIXTECH, INC.,Common Stock Purchase Agreement • May 11th, 2000 • United Microelectronics Corp • Computer terminals • Delaware
Contract Type FiledMay 11th, 2000 Company Industry Jurisdiction
Amendment No. 2 to Deposit AgreementDeposit Agreement • March 19th, 2007 • United Microelectronics Corp • Semiconductors & related devices • New York
Contract Type FiledMarch 19th, 2007 Company Industry Jurisdiction
UNITED MICROELECTRONICS CORPORATION EMPLOYEE STOCK OPTION PLAN FOR EMPLOYEES (APPROVED BY THE TAIWAN SEC ON DECEMBER 22, 2005) STOCK OPTION AGREEMENT FOR EMPLOYEES OF UMC GROUP (USA), A SUBSIDIARY OF UNITEDMICROELECTRONICS CORPORATIONStock Option Agreement • May 10th, 2007 • United Microelectronics Corp • Semiconductors & related devices
Contract Type FiledMay 10th, 2007 Company IndustryThis Stock Option Agreement (the “Agreement”) is made and entered into as of the date of grant set forth below (the “Date of Grant”) by and between United Microelectronics Corporation, a corporation organized under the laws of Taiwan, the Republic of China (the “Company”), and the employee named below as the “Participant” (who is, on the Date of Grant, an employee of the Company’s subsidiary, UMC Group (USA) (the “Employer”)). Capitalized terms not defined herein shall have the meaning ascribed to them in the Company’s Stock Option Plan (the “Plan”).
UNITED MICROELECTRONICS CORPORATION (APPROVED BY THE TAIWAN SEC ON SEPTEMBER 30, 2004) STOCK OPTION AGREEMENT FOR EMPLOYEES OF UNITED FOUNDRY SERVICE, A SUBSIDIARY OF UNITED MICROELECTRONICS CORPORATION2004 Employee Stock Option Plan for Employees • July 26th, 2005 • United Microelectronics Corp • Semiconductors & related devices
Contract Type FiledJuly 26th, 2005 Company IndustryThis Stock Option Agreement (the “Agreement”) is made and entered into as of the date of grant set forth below (the “Date of Grant”) by and between United Microelectronics Corporation, a corporation organized under the laws of Taiwan, the Republic of China (the “Company”), and the employee named below as the “Participant” (who is, on the Date of Grant, an employee of the Company’s subsidiary, United Foundry Service (the “Employer”)). Capitalized terms not defined herein shall have the meaning ascribed to them in the Company’s 2004 Employee Stock Option Plan for Employees (the “Plan”).
UNITED MICROELECTRONICS CORPORATION AND CITIBANK, N.A., As Depositary, AND THE HOLDERS AND BENEFICIAL OWNERS OF AMERICAN DEPOSITARY SHARES EVIDENCED BY AMERICAN DEPOSITARY RECEIPTS ISSUED UNDER THE DEPOSIT AGREEMENT, DATED AS OF SEPTEMBER 21, 2000...Deposit Agreement • March 2nd, 2006 • United Microelectronics Corp • Semiconductors & related devices • New York
Contract Type FiledMarch 2nd, 2006 Company Industry JurisdictionAMENDMENT NO. 1 TO DEPOSIT AGREEMENT, dated as of March , 2006 (this “Amendment”), by and among United Microelectronics Corp., a company organized and existing under the laws of the Republic of China (the “Company”), Citibank, N.A., a national banking association organized under the laws of the United States of America (the “Depositary”), and all Holders and Beneficial Owners from time to time of American Depositary Shares evidenced by American Depositary Receipts issued under the Deposit Agreement, dated as of September 21, 2000, as amended from time to time.
UNITED MICROELECTRONICS CORPORATION 3F, NO. 76, TUN HWA SOUTH ROAD TAIPEI, TAIWAN REPUBLIC OF CHINA As of December 12, 2001Letter Agreement • March 2nd, 2006 • United Microelectronics Corp • Semiconductors & related devices • New York
Contract Type FiledMarch 2nd, 2006 Company Industry JurisdictionReference is made to the Deposit Agreement, dated as of September 21, 2000 (the “Deposit Agreement”), by and among United Microelectronics Corporation, a company incorporated under the laws of the Republic of China (the “Company”), Citibank, N.A., as Depositary (Citibank in such capacity, the “Depositary”), and the Holders and Beneficial Owners of American Depositary Shares (the “ADSs”) evidenced by American Depositary Receipts (the “ADRs”) issued thereunder. All capitalized terms used, but not otherwise defined herein, shall have the meaning assigned thereto in the Deposit Agreement.
English Summary) LEASEUnited Microelectronics Corp • May 9th, 2007 • Semiconductors & related devices
Company FiledMay 9th, 2007 IndustryLessee shall pay the rental amount of NT$88,291 each month. The first month’s rent shall be paid to Lessor on the commencement date of this Lease. Lessee shall pay the rent to Lessor each month thereafter in accordance with the procedures set forth by Lessor in this Lease and shall separately calculate and pay business tax.
AGREEMENT AND PLAN OF MERGERAgreement and Plan of Merger • May 8th, 2009 • United Microelectronics Corp • Semiconductors & related devices • Hong Kong
Contract Type FiledMay 8th, 2009 Company Industry JurisdictionThis AGREEMENT AND PLAN OF MERGER, dated as of April 29, 2009 (this “Agreement”), among United Microelectronics Corporation (“UMC”), a company limited by shares incorporated under the laws of the Republic of China (the “ROC”), Infoshine Technology Limited (the “Company”), a company with limited liability incorporated under the laws of the British Virgin Islands, and Best Elite International Limited (“Best Elite”), a company with limited liability incorporated under the laws of the British Virgin Islands and the sole shareholder of the Company.
UNITED MICROELECTRONICS CORPORATION EMPLOYEE STOCK OPTION PLAN FOR EMPLOYEES (APPROVED BY THE TAIWAN SEC ON OCTOBER 8, 2003) STOCK OPTION AGREEMENT FOR EMPLOYEES OF UNITED FOUNDRY SERVICE, A SUBSIDIARY OF UNITED MICROELECTRONICS CORPORATIONStock Option Agreement • July 26th, 2005 • United Microelectronics Corp • Semiconductors & related devices
Contract Type FiledJuly 26th, 2005 Company IndustryThis Stock Option Agreement (the “Agreement”) is made and entered into as of the date of grant set forth below (the “Date of Grant”) by and between United Microelectronics Corporation, a corporation organized under the laws of Taiwan, the Republic of China (the “Company”), and the employee named below as the “Participant” (who is, on the Date of Grant, an employee of the Company’s subsidiary, United Foundry Service (the “Employer”)). Capitalized terms not defined herein shall have the meaning ascribed to them in the Company’s Stock Option Plan (the “Plan”).
Summary) LEASELease • May 9th, 2007 • United Microelectronics Corp • Semiconductors & related devices
Contract Type FiledMay 9th, 2007 Company Industry
UNITED MICROELECTRONICS CORPORATION TAIWAN, REPUBLIC OF CHINAUnited Microelectronics Corp • March 2nd, 2006 • Semiconductors & related devices • New York
Company FiledMarch 2nd, 2006 Industry JurisdictionReference is made to the Deposit Agreement, dated as of September 21, 2000, as amended from time to time (the "Deposit Agreement"), by and among United Microelectronics Corporation, a company incorporated under the laws of the Republic of China (the "Company"), Citibank, N.A., as Depositary (the "Depositary"), and the Holders and Beneficial Owners of American Depositary Shares (the "ADSs") evidenced by American Depositary Receipts (the "ADRs") issued thereunder. All capitalized terms used, but not otherwise defined herein, shall have the meaning assigned thereto in the Deposit Agreement.
Translation) MERGER AGREEMENTMerger Agreement • June 17th, 2004 • United Microelectronics Corp • Semiconductors & related devices
Contract Type FiledJune 17th, 2004 Company IndustryUnited Microelectronics Corporation, a Republic of China (“R.O.C.”) company limited by shares with its registered offices at No.3, Li-Hsin Rd. II, Hsinchu Science Park, Hsinchu, Taiwan, R.O.C (“UMC”), and
UNITED MICROELECTRONICS CORPORATION NO. 3 LI-HSIN ROAD II, HSINCHU SCIENCE PARK HSINCHU, TAIWAN REPUBLIC OF CHINA As of October 5, 2005Letter Agreement • March 2nd, 2006 • United Microelectronics Corp • Semiconductors & related devices • New York
Contract Type FiledMarch 2nd, 2006 Company Industry JurisdictionReference is hereby made to the Deposit Agreement, dated as of September 21, 2000 as amended and supplemented from time to time (the “Deposit Agreement”), by and among United Microelectronics Corporation, a company incorporated under the laws of the Republic of China (the “Company”), Citibank, N.A., as Depositary (Citibank, N.A. in such capacity, the “Depositary”), and the Holders and Beneficial Owners of American Depositary Shares (the “ADSs”) evidenced by American Depositary Receipts (the “ADRs”) issued thereunder. All capitalized terms used, but not otherwise defined herein, shall have the meaning assigned thereto in the Deposit Agreement.
English Summary) LEASEUnited Microelectronics Corp • May 9th, 2007 • Semiconductors & related devices
Company FiledMay 9th, 2007 IndustryThe total amount of monthly rent shall be one million three hundred twelve thousand and eight hundred eighty New Taiwan Dollars (NT$1,312,880).
ContractUnited Microelectronics Corp • October 14th, 2009 • Semiconductors & related devices
Company FiledOctober 14th, 2009 IndustryForm of Amended and Restated Deposit Agreement, among United Microelectronics Corporation, JPMorgan Chase Bank, N.A. as depositary, and all Holders and Beneficial Owners from time to time of American Depositary Receipts issued thereunder.