1.2 Devotion of Services. Employee shall devote his entire -------------------- productive time, ability and attention exclusively to the business of Company during the term of this Agreement, except for passive investments, charitable and non-profit...Employment Agreement • June 13th, 1997 • Osi Systems Inc • California
3,700,000 Shares/1/ OSI SYSTEMS, INC. Common Stock UNDERWRITING AGREEMENT ----------------------Underwriting Agreement • October 1st, 1997 • Osi Systems Inc • Semiconductors & related devices • California
RECITALS: --------Purchase and Sale Agreement • November 13th, 1998 • Osi Systems Inc • Semiconductors & related devices • California
EXHIBIT 10.12 AMENDMENT NUMBER TWO TO LEASE This Amendment Number Two to Lease, dated October 24, 1995, (the "Amendment"), for reference purposes only, is hereby made a part of that certain lease dated January 1, 1989, by an between KB Management...Lease • June 13th, 1997 • Osi Systems Inc
TERM LOAN)Credit Agreement • May 14th, 2001 • Osi Systems Inc • Semiconductors & related devices • California
DATED 4 July 1986Lease • August 15th, 1997 • Osi Systems Inc • Semiconductors & related devices
EXHIBIT 10.11 JOINT VENTURE AGREEMENTJoint Venture Agreement • August 1st, 1997 • Osi Systems Inc • Semiconductors & related devices • California
OSI SYSTEMS, INC. AND BRANCH BANKING AND TRUST COMPANY, as Trustee INDENTURE Dated as of February 22, 2017 1.25% Convertible Senior Notes due 2022Indenture • February 22nd, 2017 • Osi Systems Inc • Semiconductors & related devices • New York
INDENTURE dated as of February 22, 2017 between OSI SYSTEMS, INC., a Delaware corporation, as issuer (the “Company,” as more fully set forth in Section 1.01) and BRANCH BANKING AND TRUST COMPANY, a banking corporation organized under the laws of North Carolina, as trustee (the “Trustee,” as more fully set forth in Section 1.01).
andRights Agreement • August 1st, 2000 • Osi Systems Inc • Semiconductors & related devices • California
EXHIBIT 10.7 EMPLOYMENT AGREEMENT -------------------- THIS EMPLOYMENT AGREEMENT ("Agreement") is made and entered into this 1st day of April, 1997, by and between RAPISCAN SECURITY PRODUCTS LTD. ("Company"), a United Kingdom corporation, and ANTHONY...Employment Agreement • June 13th, 1997 • Osi Systems Inc • California
Exhibit 10.23 EMPLOYMENT AGREEMENT -------------------- THIS EMPLOYMENT AGREEMENT ("Agreement") is made and entered into this 1st day of September, 2000, by and between OSI SYSTEMS, INC. ("Company"), a California corporation, and AJAY MEHRA...Employment Agreement • September 28th, 2000 • Osi Systems Inc • Semiconductors & related devices • California
EXHIBIT 10.17 LICENSE AGREEMENT THIS AGREEMENT is made and entered into as of the 19th day of December 1994, by and between: EG&G Inc., a corporation of the Commonwealth of Massachusetts, having a principal place of business at EG&G Instruments Group,...License Agreement • June 13th, 1997 • Osi Systems Inc • California
EXHIBIT 10.5 EMPLOYMENT AGREEMENT -------------------- THIS EMPLOYMENT AGREEMENT ("Agreement") is made and entered into this 1st day of March, 1993, by and between Rapiscan Security Products (U.S.A.), Inc. ("Company"), a California corporation, and...Employment Agreement • August 15th, 1997 • Osi Systems Inc • Semiconductors & related devices • California
EXHIBIT 10.10 INDEMNITY AGREEMENT ------------------- This Indemnity Agreement (the "Agreement) is made as of _________________, by and between OSI Systems, Inc., a California corporation (the "Corporation"), and ___________...Indemnity Agreement • August 15th, 1997 • Osi Systems Inc • Semiconductors & related devices • California
EXHIBIT 10.16 CREDIT AGREEMENT by and between OPTO SENSORS, INC., a California corporation UDT SENSORS, INC., a California corporation RAPISCAN SECURITY PRODUCTS (U.S.A.), INC., a California corporation FERSON OPTICS, INC., a California corporationCredit Agreement • June 13th, 1997 • Osi Systems Inc
WITNESSETH:Stock Purchase Agreement • June 13th, 1997 • Osi Systems Inc
EXHIBIT 10.5 EMPLOYMENT AGREEMENT -------------------- THIS EMPLOYMENT AGREEMENT ("Agreement") is made and entered into this 1st day of April, 1997, by and between RAPISCAN SECURITY PRODUCTS (U.S.A.), INC. ("Company"), a California corporation, and...Employment Agreement • June 13th, 1997 • Osi Systems Inc • California
EXHIBIT 10.4 EMPLOYMENT AGREEMENT -------------------- THIS EMPLOYMENT AGREEMENT ("Agreement") is made and entered into this 1st day of April, 1997, by and between OPTO SENSORS, INC. ("Company"), a California corporation, and AJAY MEHRA ("Employee"),...Employment Agreement • June 13th, 1997 • Osi Systems Inc • California
INDEMNIFICATION AGREEMENTIndemnification Agreement • August 27th, 2010 • Osi Systems Inc • Semiconductors & related devices • Delaware
THIS AGREEMENT is entered into, effective as , by and between OSI Systems, Inc., a Delaware corporation (the “Company”), and (“Indemnitee”).
EXHIBIT 10.14Tenancy Agreement • June 13th, 1997 • Osi Systems Inc
SECTION DEFINITIONSCredit Agreement • September 28th, 1999 • Osi Systems Inc • Semiconductors & related devices • California
OSI Systems, Inc. and U.S. Bank Trust Company, National Association as Trustee INDENTURE Dated as of July 19, 2024 2.25% Convertible Senior Notes due 2029Indenture • July 19th, 2024 • Osi Systems Inc • Semiconductors & related devices • New York
INDENTURE, dated as of July 19, 2024, between OSI Systems, Inc., a Delaware corporation, as issuer (the “Company”), and U.S. Bank Trust Company, National Association, as trustee (the “Trustee”).
SEVENTH AMENDMENT TO CREDIT AGREEMENTCredit Agreement • December 27th, 2021 • Osi Systems Inc • Semiconductors & related devices • New York
CREDIT AGREEMENT, dated as of October 15, 2010 among osi systems, inc., a Delaware corporation (the “Borrower”), each of those Domestic Subsidiaries of the Borrower identified as a “Guarantor” on the signature pages hereto and such other Domestic Subsidiaries of the Borrower as may from time to time become a party hereto (such Subsidiaries, each a “Guarantor” and collectively, the “Guarantors”), the several banks and other financial institutions as are, or may from time to time become parties to this Agreement (each a “Lender” and, collectively, the “Lenders”), and WELLS FARGO BANK, NATIONAL ASSOCIATION (successor-by-merger to Wachovia Bank, National Association), a national banking association, as administrative agent for the Lenders hereunder (in such capacity, the “Administrative Agent”).
C. AGREEMENT ------------Cooperative Research and Development Agreement • November 16th, 1998 • Osi Systems Inc • Semiconductors & related devices
SECTION 2 REVOLVING LINE OF CREDIT 2.01 THE REVOLVING LINE OF CREDIT. On terms and conditions as set forth herein, the Bank agrees to make Revolving Advances in Dollars or in Alternate Currency to each Borrower from time to time from the date hereof...Credit Agreement • September 28th, 1998 • Osi Systems Inc • Semiconductors & related devices • California
RECITALS: --------Purchase and Sale Agreement • September 28th, 1998 • Osi Systems Inc • Semiconductors & related devices • California
REGISTRATION RIGHTS AGREEMENTRegistration Rights Agreement • June 2nd, 2004 • Osi Systems Inc • Semiconductors & related devices • New York
This Registration Rights Agreement (this “Agreement”) is made and entered into as of June 1, 2004, by and among OSI Systems, Inc., a California corporation (the “Company”), and the investors signatory hereto (each a “Purchaser” and collectively, the “Purchasers”).
OSI SYSTEMS, INC. (a Delaware corporation)Purchase Agreement • February 22nd, 2017 • Osi Systems Inc • Semiconductors & related devices • New York
OSI Systems, Inc., a Delaware corporation (the “Company”), confirms its agreement with you and each of the other Initial Purchasers named in Schedule A hereto (collectively, the “Initial Purchasers,” which term shall also include any initial purchaser substituted as hereinafter provided in Section 10 hereof), for whom you are acting as Representatives (in such capacity, the “Representatives”), with respect to (i) the sale by the Company and the purchase by the Initial Purchasers, acting severally and not jointly, of the respective principal amounts set forth in said Schedule A of $250,000,000 aggregate principal amount of the Company’s 1.25% Convertible Senior Notes due 2022 (the “Initial Securities”) and (ii) the grant by the Company to the Initial Purchasers, acting severally and not jointly, of the option to purchase all or any part of an additional $37,500,000 aggregate principal amount of its 1.25% Convertible Senior Notes due 2022 (the “Option Securities” and, together with the I
EIGHTH AMENDMENT TO CREDIT AGREEMENTCredit Agreement • August 19th, 2022 • Osi Systems Inc • Semiconductors & related devices • New York
CREDIT AGREEMENT, dated as of October 15, 2010 among OSI SYSTEMS, INC., a Delaware corporation (the “Borrower”), each of those Domestic Subsidiaries of the Borrower identified as a “Guarantor” on the signature pages hereto and such other Domestic Subsidiaries of the Borrower as may from time to time become a party hereto (such Subsidiaries, each a “Guarantor” and collectively, the “Guarantors”), the several banks and other financial institutions as are, or may from time to time become parties to this Agreement (each a “Lender” and, collectively, the “Lenders”), and WELLS FARGO BANK, NATIONAL ASSOCIATION (successor-by-merger to Wachovia Bank, National Association), a national banking association, as administrative agent for the Lenders hereunder (in such capacity, the “Administrative Agent”).
RECITALS: --------Purchase and Sale Agreement • November 13th, 1998 • Osi Systems Inc • Semiconductors & related devices • California
EMPLOYMENT AGREEMENTEmployment Agreement • October 30th, 2015 • Osi Systems Inc • Semiconductors & related devices • California
THIS EMPLOYMENT AGREEMENT (the “Agreement”) is made and entered into as of January 1, 2012 (“Effective Date”) by and between Spacelabs Healthcare, Inc., a California corporation (the “Company”), and Nicholas Ong (“Executive”).
Exhibit 10.7 STRICTLY PRIVATE AND CONFIDENTIAL --------------------------------- NOTE: - This Agreement constitutes A PRINCIPAL STATEMENT OF MAIN PARTICULARS OF EMPLOYMENT, as required and in accordance with the Employment Protection (Consolidation)...Employment Agreement • August 15th, 1997 • Osi Systems Inc • Semiconductors & related devices
CREDIT AGREEMENT among OSI SYSTEMS, INC., as Borrower, CERTAIN DOMESTIC SUBSIDIARIES OF THE BORROWER FROM TIME TO TIME PARTY HERETO, as Guarantors, THE LENDERS PARTY HERETO, WELLS FARGO BANK, NATIONAL ASSOCIATION, as Administrative Agent, BANK OF...Credit Agreement • October 19th, 2010 • Osi Systems Inc • Semiconductors & related devices • New York
CREDIT AGREEMENT, dated as of October 15, 2010 among OSI SYSTEMS, INC., a Delaware corporation (the “Borrower”), each of those Domestic Subsidiaries of the Borrower identified as a “Guarantor” on the signature pages hereto and such other Domestic Subsidiaries of the Borrower as may from time to time become a party hereto (such Subsidiaries, each a “Guarantor” and collectively, the “Guarantors”), the several banks and other financial institutions as are, or may from time to time become parties to this Agreement (each a “Lender” and, collectively, the “Lenders”), and WELLS FARGO BANK, NATIONAL ASSOCIATION (successor-by-merger to Wachovia Bank, National Association), a national banking association, as administrative agent for the Lenders hereunder (in such capacity, the “Administrative Agent”).
CREDIT AGREEMENTCredit Agreement • July 24th, 2006 • Osi Systems Inc • Semiconductors & related devices • California
THIS CREDIT AGREEMENT (the “Agreement”) is made and dated as of the 18th day of July, 2006, by and among BANK OF THE WEST (“BOW”) and the other lenders from time to time party hereto (each of BOW and such other lenders, being referred to herein individually as a “Lender” and, collectively, as the “Lenders”), BOW, as agent for the Lenders (in such capacity, the “Agent”), BOW, as the issuer of letters of credit hereunder (in such capacity, the “L/C Issuing Bank”), and SPACELABS HEALTHCARE, INC., a Delaware corporation (the “Company”).
AMENDMENT TO EMPLOYMENT AGREEMENTEmployment Agreement • January 28th, 2016 • Osi Systems Inc • Semiconductors & related devices
This Amendment (“Amendment”) to that certain EMPLOYMENT AGREEMENT (the “Agreement”) entered into as of January 1, 2012 by and between OSI Systems, Inc., a Delaware corporation (the “Company”), and Victor Sze (“Executive”) is made effective July 1, 2015.
