LEASE SUMMARYLease Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Florida
INTERSIL B.V.Share Purchase Agreement • August 17th, 2000 • Intersil Holding Co • Semiconductors & related devices
200,000 UnitsRegistration Rights Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • New York
10,000,000 Shares INTERSIL HOLDING CORPORATION Class A Common Stock UNDERWRITING AGREEMENTUnderwriting Agreement • September 14th, 2000 • Intersil Holding Co • Semiconductors & related devices • New York
LOAN AGREEMENTLoan Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Pennsylvania
EXHIBIT 4.02 AMENDED AND RESTATED REGISTRATION RIGHTS AGREEMENT AMENDED AND RESTATED REGISTRATION RIGHTS AGREEMENT (the "Agreement") dated as of January 21, 2000 amends and restates the Registration Rights Agreement dated August 13, 1999, by and among...Registration Rights Agreement • February 18th, 2000 • Intersil Holding Co • Semiconductors & related devices • Delaware
CONFORMED COPY AMENDMENT NO. 1 AND WAIVER dated as of January 28, 2000 (this "Amendment"), to the CREDIT AGREEMENT dated as of August 13, 1999 (the "Credit Agreement"), among INTERSIL CORPORATION, a Delaware corporation (the "Borrower"), INTERSIL...Credit Agreement • February 23rd, 2000 • Intersil Holding Co • Semiconductors & related devices • New York
CONFORMED COPY CREDIT AGREEMENT dated as of August 13, 1999,Credit Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • New York
Exhibit 11 ---------- AMENDMENT TO RIGHTS AGREEMENT AMENDMENT, dated March 10, 2002 (this "Amendment"), to the Rights Agreement, dated as of September 14, 1998 (the "Rights Agreement"), between Elantec Semiconductor, Inc., a Delaware corporation...Rights Agreement • March 20th, 2002 • Intersil Corp/De • Semiconductors & related devices • Delaware
AMENDED AND RESTATED CREDIT AGREEMENT Dated as of July 19, 2016 among INTERSIL CORPORATION, as the Borrower, BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer, and The Other Lenders Party Hereto BANK OF AMERICA MERRILL...Credit Agreement • July 21st, 2016 • Intersil Corp/De • Semiconductors & related devices • New York
This AMENDED AND RESTATED CREDIT AGREEMENT (“Agreement”) is entered into as of July 19, 2016, among INTERSIL CORPORATION, a Delaware corporation (the “Borrower”), each lender from time to time party hereto (collectively, the “Lenders” and individually, a “Lender”), and BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer.
andRights Agreement • September 5th, 2003 • Intersil Corp/De • Semiconductors & related devices • New York
Exhibit 1.01 14,000,000 SHARES INTERSIL CORPORATION CLASS A COMMON STOCK UNDERWRITING AGREEMENTUnderwriting Agreement • October 23rd, 2001 • Intersil Corp/De • Semiconductors & related devices • New York
Background ----------Employment Agreement • April 10th, 2002 • Intersil Corp/De • Semiconductors & related devices • New York
Background ----------Employment Agreement • April 10th, 2002 • Intersil Corp/De • Semiconductors & related devices • New York
EXHIBIT 2.1 ----------- AGREEMENT AND PLAN OF MERGER BY AND AMONG INTERSIL CORPORATION, ECHO ACQUISITION, INC.Merger Agreement • March 12th, 2002 • Intersil Corp/De • Semiconductors & related devices • Delaware
PURCHASE AGREEMENT BETWEEN HARRIS SEMICONDUCTOR AND PRAXAIR, INC.Purchase Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Florida
AGREEMENT between theCollective Bargaining Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices
o SharesUnderwriting Agreement • February 4th, 2000 • Intersil Holding Co • Semiconductors & related devices • New York
AMENDMENT NUMBER 1 TO THE SHARE PURCHASE AGREEMENT THIS AMENDMENT NUMBER 1 ("Amendment") to the Share Purchase Agreement of even date herewith between the same parties ("Agreement") is made and entered into as of the 27th day of April, by and among...Share Purchase Agreement • August 17th, 2000 • Intersil Holding Co • Semiconductors & related devices
RECITALS:Asset Purchase Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Florida
INDENTUREIndenture • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • New York
EXHIBIT 10.35 INVESTMENT ADVISORY AGREEMENTInvestment Advisory Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Maryland
INDEMNITY AGREEMENTIndemnification Agreement • October 28th, 2014 • Intersil Corp/De • Semiconductors & related devices • Delaware
THIS AGREEMENT is made as of the last date signed below (the “Effective Date”) by and between Intersil Corporation., a Delaware corporation ("Company"), and _______________ ("Indemnitee"), an officer or director of the Company.
EXHIBIT 10.41 ASSET TRANSFER AGREEMENTAsset Transfer Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Florida
EXHIBIT 10.40 INTELLECTUAL PROPERTY AGREEMENTIntellectual Property Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Florida
a) (i) The Shares listed on Annex A opposite the Stockholder's name are ------- the only shares of Company capital stock, securities convertible into Company capital stock, or other rights in respect of Company capital stock (collectively, "Company...Company Voting Agreement • March 20th, 2002 • Intersil Corp/De • Semiconductors & related devices • Delaware
BetweenInvestment Advisory Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Maryland
EXHIBIT 10.08 REGISTRATION RIGHTS AGREEMENT REGISTRATION RIGHTS AGREEMENT (the "Agreement") dated August 13, 1999, by and among INTERSIL HOLDING CORPORATION, a Delaware corporation formerly known as HSS Holding Corporation (the "Company"), STERLING...Registration Rights Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Delaware
AMENDMENT NO. 4 TO SECURITIES PURCHASE AND HOLDERS AGREEMENTSecurities Purchase and Holders Agreement • May 14th, 2002 • Intersil Corp/De • Semiconductors & related devices • Delaware
COMPANY VOTING AGREEMENTCompany Voting Agreement • March 19th, 2004 • Intersil Corp/De • Semiconductors & related devices • California
AGREEMENT, dated as of March 14, 2004 (this “Agreement”), by and among Intersil Corporation, a Delaware corporation (“Parent”), New Castle Merger Sub Corp., a California corporation and wholly-owned subsidiary of Parent (“Merger Sub”), Xicor, Inc., a California corporation (“Company”), and the shareholders of the Company set forth in Annex A hereto (each a “Shareholder” and, collectively, the “Shareholders”).
FORM OF TENDER AND VOTING AGREEMENTTender and Voting Agreement • March 22nd, 2010 • Intersil Corp/De • Semiconductors & related devices • Delaware
THIS TENDER AND VOTING AGREEMENT (this “Agreement”) dated March 22, 2010, among INTERSIL CORPORATION, a Delaware corporation (“Parent”); NAVAJO MERGER SUB, INC., a Delaware corporation and an indirect wholly-owned subsidiary of Parent (“Purchaser”); TECHWELL, INC., a Delaware corporation (the “Company”) (only with respect to Section 6 and Section 11 hereof and as a third party beneficiary of Section 4(f) hereof); and the undersigned stockholder of the Company (“Stockholder”).
EXHIBIT 10.38Commercial Supply Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices
EXECUTIVE CHANGE IN CONTROL SEVERANCE BENEFITS AGREEMENTExecutive Change in Control Severance Benefits Agreement • August 12th, 2002 • Intersil Corp/De • Semiconductors & related devices • California
THIS EXECUTIVE CHANGE IN CONTROL SEVERANCE BENEFITS AGREEMENT (the “AGREEMENT” ) is entered into on May 14, 2002, between Mohan Maheswaran (“Executive”) and INTERSIL CORPORATION , a Delaware corporation (the “COMPANY” ).
AGREEMENT AND PLAN OF MERGER among: INTERSIL CORPORATION, a Delaware corporation; NAVAJO MERGER SUB, INC., a Delaware corporation; and TECHWELL, INC. a Delaware corporation Dated March 22, 2010Merger Agreement • March 22nd, 2010 • Intersil Corp/De • Semiconductors & related devices • Delaware
THIS AGREEMENT AND PLAN OF MERGER (“Agreement”) is made and entered into on March 22, 2010, by and among: INTERSIL CORPORATION, a Delaware corporation (“Parent”); NAVAJO MERGER SUB, INC., a Delaware corporation and an indirect wholly owned subsidiary of Parent (“Purchaser”); and TECHWELL, INC., a Delaware corporation (the “Company”). Certain capitalized terms used in this Agreement are defined in EXHIBIT A and other capitalized terms used in this Agreement are defined in the Sections of this Agreement where they first appear.
RECITALSJoint Venture Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices
