FORM OF UNDERWRITING AGREEMENT ADVANCED SEMICONDUCTOR ENGINEERING, INC.Underwriting Agreement • April 24th, 2003 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices • New York
EXHIBIT A Share Purchase Agreement This Agreement is made on this 19th day of May, 2001 by and between A.S.E. Holding Limited, a company incorporated under the laws of Bermuda and having a registered office at Cedar House, 41 Cedar Avenue, Hamilton HM...Share Purchase Agreement • June 11th, 2001 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
SERVICE AGREEMENTService Agreement • June 30th, 2004 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
Exhibit 4(jj) Lease Agreement for Public Land Managed by Export Processing Zone Administration, Ministry of Economic Affairs Ref. No. (90) Nan-Ehr-Chien-Tzu #002 This lease agreement (hereinafter referred to as the "Agreement") made and entered into...Lease Agreement • June 28th, 2001 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
SALE AND PURCHASE AGREEMENT *************************************** MESSRS GHAZI & LIM ADVOCATES & SOLICITORS 19TH FLOOR PLAZA MWE NO 8 LEBUH FARQUHAR 10200 PENANGSale and Purchase Agreement • June 28th, 2001 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
ANDDeposit Agreement • March 31st, 2003 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices • New York
DEPOSIT AGREEMENTDeposit Agreement • March 31st, 2020 • ASE Technology Holding Co., Ltd. • Semiconductors & related devices • New York
DEPOSIT AGREEMENT, dated as of April 30, 2018, by and among (i) ASE INDUSTRIAL HOLDING CO., LTD., a company organized under the laws of the Republic of China, and its successors (the “Company”), (ii) CITIBANK, N.A., a national banking association organized under the laws of the United States of America acting in its capacity as depositary, and any successor depositary hereunder (the “Depositary”), and (iii) all Holders and Beneficial Owners of American Depositary Shares issued hereunder (all such capitalized terms as hereinafter defined).
As of September 25, 2003 Citibank, N.A. - ADR Department 111 Wall Street, 20th Floor New York, New York 10043 Zero Coupon Bonds (ISIN No.: XS0176208782) Ladies and Gentlemen: Reference is made to the Amended and Restated Deposit Agreement, dated as of...Deposit Agreement • April 3rd, 2006 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices • New York
Exhibit 4(kk) First Amendment to Lease Agreement This First Amendment to Lease Agreement (the "Amendment") is made and entered into as of June 7, 2000, by and between RND Funding Company, Inc., a Delaware corporation ("Landlord"), and ISE Labs, Inc.,...Lease Agreement • June 28th, 2001 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
The ADSs are to be issued pursuant to a deposit agreement (the "Deposit Agreement"), dated as of September , 2000, among the Company, Citibank, N.A., ---- as depositary (the "Depositary"), and holders from time to time of the American Depositary...Underwriting Agreement • September 21st, 2000 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
Exhibit 4(v) SHARE SALE AND PURCHASE AGREEMENTShare Sale and Purchase Agreement • June 30th, 2004 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
Exhibit 4(h) COMMISSION AGREEMENT PARTIES: GARDEX INTERNATIONAL LIMITED ("GARDEX") (a British Virgin Islands Corporation) ASE Test Inc. ("ASET") (a Taiwan corporation) DATE: August 1, 2004Commission Agreement • June 23rd, 2005 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
SERVICE AGREEMENTService Agreement • June 30th, 2004 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
1 Exhibit 10.26 DRAFT OF AUGUST 16, 2000 FOR DISCUSSION PURPOSES ONLY EXCHANGE AGENCY AGREEMENT This Exchange Agency Agreement (the Exchange Agency Agreement, together with the Schedules thereto, in each case as amended from time to time, the...Exchange Agency Agreement • August 28th, 2000 • Advanced Semiconductor Engineering Inc • New York
WITNESSETH:Manufacturing Services Agreement • September 21st, 2000 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices • New York
Exhibit 4(b) Advanced Semiconductor Engineering, Inc. ASE (Chung Li), Inc. June 5, 2002 Motorola, Inc. Motorola Electronics Taiwan, Ltd. c/c Motorola, Inc. MD: TX30/OE60 6501 William Cannon Drive West Austin, TX 78735 USA Attn: Gary Schlumpf Fax:(512)...Asset Purchase Agreement • June 30th, 2003 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
Amendment No. 2 to Amended and Restated Deposit AgreementDeposit Agreement • October 25th, 2006 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices • New York
Exhibit 4(ll) DATED THIS 3(rd) DAY OF October, 2000 BETWEEN WAN TIEN REALTY (PTE) LTD AND ISE LABS SINGAPORE PTE LTD SUB-LEASE AGREEMENT _______________________________Sub-Lease Agreement • June 28th, 2001 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
ANDSub-Lease • June 28th, 2001 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
SERVICE AGREEMENTService Agreement • March 31st, 2003 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
Amendment No. 1 to Amended and Restated Deposit AgreementAmended and Restated Deposit Agreement • October 25th, 2006 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices • New York
Exhibit 4(g) Amendment renewing the IMMUNITY AGREEMENT entered into January 25, 1994 between Motorola, Inc. and ASE, Incorporated Motorola Inc. and ASE, Incorporated agree to amend the above-identified IMMUNITY AGREEMENT as follows: In Section 1.4,...Immunity Agreement • June 30th, 2004 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
Exhibit 14 (English Translation Summary) Ministry of Economic Affairs Export Processing Zones Administration (EPZA) Nantze Export Processing Zone Land Lease Agreements I. See Annex I for a description of lease details. II. General Provisions: The land...Land Lease Agreement • June 30th, 2004 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
RECITALSSublease Agreement • June 28th, 2001 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
BY: /s/ JOSEPH TUNG ----------------------- Title: CFO/Director Dated: May 31, 2002 Plant Building Lease AgreementPlant Building Lease Agreement • June 28th, 2002 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
Joint Share Exchange Agreement PreambleJoint Share Exchange Agreement • July 8th, 2016 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
Exhibit 4(u) LICENCE AGREEMENT THIS LICENCE AGREEMENT is made this 16th day of January, 2001. BETWEEN 1st Silicon (Malaysia) Sdn Bhd (Company No. 456668-U), a company incorporated and registered in Malaysia and having its registered office at 1,...Licence Agreement • June 28th, 2001 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
ARTICLE 1Sublease Agreement • June 28th, 2001 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
COMMISSION AGREEMENTCommission Agreement • June 19th, 2006 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
Exhibit 4(qq) Lease No. The lease is made between the landlord SHINANO KENSHI (HK) CO., LTD. (hereinafter called "Party A") and the tenant ISE LABS HONG KONG LTD. (hereinafter called "Party B"). Both parties hereby agree to enter into and abide by all...Lease Agreement • June 28th, 2001 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
COMMISSION AGREEMENTCommission Agreement • June 19th, 2006 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
SYNDICATED LOAN AGREEMENT 【English Translation】 BORROWER: ADVANCED SEMICONDUCTOR ENGINEERING INC. AGENT: CITIBANK, N.A., TAIPEI BRANCH AMOUNT: US$200,000,000 Date: May 29, 2008Syndicated Loan Agreement • June 30th, 2008 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices • New York
WHEREAS, to facilitate the Borrower’s partial funding needs in respect of the Acquisition (defined below), the Borrower has requested the Arrangers to arrange, and the Banks to extend to the Borrower, a term loan facility in an aggregate principal amount of US$200,000,000 as described in more detail below (the “Facility”); and
COMMISSION AGREEMENTCommission Agreement • June 19th, 2006 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
ASSET PURCHASE AGREEMENT by and among FLEXTRONICS MANUFACTURING (M) SDN BHD as Buyer, ASE ELECTRONICS (M) SDN. BHD. as Company Dated as of October 3, 2005Asset Purchase Agreement • June 19th, 2006 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
THIS ASSET PURCHASE AGREEMENT (the “Agreement”) is made as of October 3, 2005 (the “Agreement Date”), by and among Flextronics Manufacturing (M) Sdn Bhd (Company Registration No. 206755A, a Malaysia corporation (the “Buyer”) with its registered address at Level 14, Uptown 1, 1 Jalan SS21/58, Damansara Uptown, 47400 Petaling Jaya, Selangor Darul Ehsan, Malaysia and ASE Electronics (M) Sdn. Bhd. (Company registration No. 212592-H), a Malaysia corporation with its place of business at Phase 4, Bayan Lepas Free Industrial Zone, 11900 Penang, Malaysia and its registered address at Suite 2-1, 2nd Floor, Menara Penang Garden, No.42A Jalan Sultan Abmad Shah, 10050 Penang, Malaysia (the “Company”).
COMMISSION AGREEMENTCommission Agreement • June 19th, 2006 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
