GSI Technology, Inc. Shares of Common Stock SALES AGREEMENTSales Agreement • August 1st, 2023 • Gsi Technology Inc • Semiconductors & related devices
GSI Technology Inc., a Delaware corporation (the “Company”), confirms as follows its agreements with Needham & Company, LLC (the “Sales Agent”).
GSI TECHNOLOGY, INC. STOCK OPTION AGREEMENTStock Option Agreement • November 4th, 2016 • Gsi Technology Inc • Semiconductors & related devices • California
GSI Technology, Inc. (the “Company”) has granted to the Participant named in the Notice of Grant of Stock Option (the “Grant Notice”) to which this Stock Option Agreement (the “Option Agreement”) is attached an option (the “Option”) to purchase certain shares of Stock upon the terms and conditions set forth in the Grant Notice and this Option Agreement. The Option has been granted pursuant to and shall in all respects be subject to the terms and conditions of the GSI Technology, Inc. 2016 Equity Incentive Plan (the “Plan”), as amended to the Date of Grant, the provisions of which are incorporated herein by reference. By signing the Grant Notice, the Participant: (a) acknowledges receipt of, and represents that the Participant has read and is familiar with, the Grant Notice, this Option Agreement, the Plan and a prospectus for the Plan prepared in connection with the registration with the Securities and Exchange Commission of shares issuable pursuant to the Option (the “Plan Prospectus”
INDEMNITY AGREEMENTIndemnity Agreement • January 10th, 2007 • Gsi Technology Inc • Semiconductors & related devices • Delaware
6,131,111 Shares* GSI TECHNOLOGY, INC. Common Stock UNDERWRITING AGREEMENTUnderwriting Agreement • March 29th, 2007 • Gsi Technology Inc • Semiconductors & related devices • New York
GSI Technology, Inc., a Delaware corporation (the “Company”), proposes to issue and sell 6,131,111 shares (the “Firm Shares”) of the Company’s Common Stock, $0.001 par value per share (the “Common Stock”), to you and to the several other Underwriters named in Schedule I hereto (collectively, the “Underwriters”), for whom you are acting as representatives (the “Representatives”) and Needham & Company, LLC and W.R. Hambrecht + Co., LLC are acting as joint book-running managers (the “Joint Book-running Managers”). The stockholders of the Company named in Schedule II hereto (the “Selling Stockholders”) have also agreed to grant to you and the other Underwriters an option (the “Option”) to purchase up to an additional 919,667 shares of Common Stock, on the terms and for the purposes set forth in Section 1(b) (the “Option Shares”). The Firm Shares and the Option Shares are referred to collectively herein as the “Shares.”
STANDARD INDUSTRIAL/COMMERCIAL MULTI-TENANT LEASE—MODIFIED NET AMERICAN INDUSTRIAL REAL ESTATE ASSOCIATIONLease • January 10th, 2007 • Gsi Technology Inc • Semiconductors & related devices
REDACTED VERSION - CONFIDENTIAL TREATMENT REQUESTED MASTER PURCHASE AGREEMENTMaster Purchase Agreement • November 4th, 2011 • Gsi Technology Inc • Semiconductors & related devices • California
This Master Purchase Agreement (“Agreement”) is made as of July 18, 2011 (“Effective Date”) between Cisco Systems International B.V., a Dutch corporation, having its principal place of business at Haalerbergpark, Haalerbergweg 13-19, 1101 CH, Amsterdam, The Netherlands, on behalf of itself and its Subsidiaries (collectively, "Cisco"), and GSI Technology, Inc., a Delaware corporation having a place of business at 1213 Elko Dr., Sunnyvale, CA 94089 (“Supplier”).
GSI TECHNOLOGY, INC. STOCK OPTION AGREEMENTStock Option Agreement • November 4th, 2016 • Gsi Technology Inc • Semiconductors & related devices • California
GSI Technology, Inc. (the “Company”) has granted to the Participant named in the Notice of Grant of Stock Option (the “Grant Notice”) to which this Stock Option Agreement (the “Option Agreement”) is attached an option (the “Option”) to purchase certain shares of Stock upon the terms and conditions set forth in the Grant Notice and this Option Agreement. The Option has been granted pursuant to and shall in all respects be subject to the terms and conditions of the GSI Technology, Inc. 2016 Equity Incentive Plan (the “Plan”), as amended to the Date of Grant, the provisions of which are incorporated herein by reference. By signing the Grant Notice, the Participant: (a) acknowledges receipt of, and represents that the Participant has read and is familiar with, the Grant Notice, this Option Agreement, the Plan and a prospectus for the Plan prepared in connection with the registration with the Securities and Exchange Commission of shares issuable pursuant to the Option (the “Plan Prospectus”
Tai Yuan Hi-Tech Industrial Park Factory Lease AgreementFactory Lease Agreement • September 11th, 2012 • Gsi Technology Inc • Semiconductors & related devices
for the purpose of rental of properties in Tai Yuan Hi-Tech Industrial Park. Both parties to this agreement concur to comply with the conditions hereinbelow provided:
GSI TECHNOLOGY, INC. STOCK OPTION AGREEMENT (For Non-U.S. Participant)Stock Option Agreement • June 4th, 2007 • Gsi Technology Inc • Semiconductors & related devices • California
GSI Technology, Inc. has granted to the Participant named in the Notice of Grant of Stock Option (the “Grant Notice”) to which this Stock Option Agreement (the “Option Agreement”) is attached an option (the “Option”) to purchase certain shares of Stock upon the terms and conditions set forth in the Grant Notice and this Option Agreement. The Option has been granted pursuant to and shall in all respects be subject to the terms and conditions of the GSI Technology, Inc. 2007 Equity Incentive Plan (the “Plan”), as amended to the Date of Grant, the provisions of which are incorporated herein by reference. By signing the Grant Notice, the Participant: (a) acknowledges receipt of and represents that the Participant has read and is familiar with the Grant Notice, this Option Agreement, the Plan and a prospectus for the Plan prepared in connection with the registration with the Securities and Exchange Commission of shares issuable pursuant to the Option (the “Plan Prospectus”), (b) accepts the
Tai Yuan Hi-Tech Industrial Park Factory Lease AgreementFactory Lease Agreement • August 19th, 2020 • Gsi Technology Inc • Semiconductors & related devices
for the purpose of reantal of properties in Tai Yuan Hi-Tech Industrial Park. Both parties to this agreement concur to comply with the conditions hereinbelow provided:
LEASE AGREEMENT by and between DRSIP/ELKO, LLC (“Landlord”) and GSI TECHNOLOGY, INC. (“Tenant”) June 6, 2024 Property: 1213 Elko Drive, Sunnyvale, CaliforniaLease Agreement • June 11th, 2024 • Gsi Technology Inc • Semiconductors & related devices • California
THIS LEASE AGREEMENT (this “Lease”) is made and entered into this 6th day of June, 2024 (the “Effective Date”), by and between DRSIP/ELKO, LLC, a California limited liability company (“Landlord”) and GSI TECHNOLOGY, INC., a Delaware corporation (“Tenant”).
INTELLECTUAL PROPERTY AGREEMENTIntellectual Property Agreement • November 16th, 2009 • Gsi Technology Inc • Semiconductors & related devices • California
This Intellectual Property Agreement is made and entered into as of August 28, 2009 by and between GSI Technology, Inc., a Delaware corporation (“PURCHASER”), on the one hand, and Sony Electronics Inc. (“SONY”), a Delaware corporation, on the other hand. PURCHASER and SONY are referred to individually as a “Party” and collectively as the “Parties”.
ASSET PURCHASE AGREEMENTAsset Purchase Agreement • November 16th, 2009 • Gsi Technology Inc • Semiconductors & related devices • California
This ASSET PURCHASE AGREEMENT (this “Agreement”) is made and entered into as of August 28, 2009 by and between GSI Technology, Inc., a Delaware corporation (“Purchaser”), on the one hand, and Sony Electronics Inc., a Delaware corporation (“Seller”), on the other hand.
RENTAL AGREEMENTAgreement • April 13th, 2004 • Gsi Technology Inc
This agreement, entered into this first day of October 1999, by and between UNITED ENERGY CORP. and GSI, hereinafter called respectively lessor and lessee.
STOCK PURCHASE AGREEMENTStock Purchase Agreement • February 8th, 2016 • Gsi Technology Inc • Semiconductors & related devices • California
THIS STOCK PURCHASE AGREEMENT (as amended, modified or supplemented from time to time in accordance with the terms hereof) (this “Agreement”) is made and entered into as of November 23, 2015 by and among GSI TECHNOLOGY, INC., a Delaware corporation (“Parent”), GSI TECHNOLOGY HOLDINGS, INC., a Cayman Islands corporation and wholly-owned subsidiary of Parent (“Buyer”), MIKAMONU GROUP LTD., an Israeli corporation (the “Company”), Avidan Akerib (“Akerib”), Ruth Orda (“Orda”) and Itai Leshem, as trustee (“Leshem”) (each of Akerib, Orda and Leshem a “Shareholder” and, collectively, the “Shareholders”), and Orda in her additional capacity as Shareholders’ Representative.
PURCHASE AND SALE AGREEMENT WITH ESCROW INSTRUCTIONS (1213 Elko Drive, Sunnyvale, California) By and Between GSI Technology, Inc., a Delaware corporation, as Seller and D.R. STEPHENS & COMPANY, LLC, California limited liability company, as Buyer dated...Purchase and Sale Agreement With Escrow Instructions • April 3rd, 2024 • Gsi Technology Inc • Semiconductors & related devices
who proved to me on the basis of satisfactory evidence to be the person(s) whose name(s) is/are subscribed to the within instrument and acknowledged to me that he/she/they executed the same in his/her/their authorized capacity(ies), and that by his/her/their signature(s) on the instrument the person(s), or the entity upon behalf of which the person(s) acted, executed the instrument.
LEASE AGREEMENT by and between (“Landlord”) and GSI TECHNOLOGY, INC. (“Tenant”) Property: 1213 Elko Drive, Sunnyvale, CaliforniaLease Agreement • April 3rd, 2024 • Gsi Technology Inc • Semiconductors & related devices • California
THIS LEASE AGREEMENT (this “Lease”) is made and entered into this day of __________, 2024 (the “Effective Date”), by and between ________________________, a _______________________________ (“Landlord”) and GSI TECHNOLOGY, INC., a Delaware corporation (“Tenant”).
SECOND AMENDMENT TO PURCHASE AND SALE AGREEMENT WITH ESCROW INSTRUCTIONSPurchase and Sale Agreement With Escrow Instructions • May 22nd, 2024 • Gsi Technology Inc • Semiconductors & related devices
This SECOND AMENDMENT TO PURCHASE AND SALE AGREEMENT WITH ESCROW INSTRUCTIONS (this “Amendment”), is made and entered into on May 17, 2024, by GSI TECHNOLOGY, INC., a Delaware corporation (“Seller”), and D.R. STEPHENS & COMPANY, LLC, a California limited liability company (“Buyer”).
Tai Yuan Hi-Tech Industrial Park Factory Lease AgreementFactory Lease Agreement • September 27th, 2017 • Gsi Technology Inc • Semiconductors & related devices
for the purpose of rental of properties in Tai Yuan Hi-Tech Industrial Park. Both parties to this agreement concur to comply with the conditions hereinbelow provided:
Tai Yuan Hi-Tech Industrial Park Factory Lease AgreementFactory Lease Agreement • June 2nd, 2011 • Gsi Technology Inc • Semiconductors & related devices
for the purpose of rental of properties in Tai Yuan Hi-Tech Industrial Park. Both parties to this agreement concur to comply with the conditions hereinbelow provided:
FIRST AMENDMENT TO PURCHASE AND SALE AGREEMENT WITH ESCROW INSTRUCTIONSPurchase and Sale Agreement With Escrow Instructions • May 2nd, 2024 • Gsi Technology Inc • Semiconductors & related devices
This FIRST AMENDMENT TO PURCHASE AND SALE AGREEMENT WITH ESCROW INSTRUCTIONS (this “Amendment”), is made and entered into on April 30, 2024, by GSI TECHNOLOGY, INC., a Delaware corporation (“Seller”), and D.R. STEPHENS & COMPANY, LLC, a California limited liability company (“Buyer”).
THIRD AMENDMENT TO PURCHASE AND SALE AGREEMENT WITH ESCROW INSTRUCTIONSPurchase and Sale Agreement With Escrow Instructions • May 22nd, 2024 • Gsi Technology Inc • Semiconductors & related devices
This THIRD AMENDMENT TO PURCHASE AND SALE AGREEMENT WITH ESCROW INSTRUCTIONS (this “Amendment”), is made and entered into on May 21, 2024, by GSI TECHNOLOGY, INC., a Delaware corporation (“Seller”), and D.R. STEPHENS & COMPANY, LLC, a California limited liability company (“Buyer”).
AGREEMENT OF PURCHASE AND SALEAgreement of Purchase and Sale • November 16th, 2009 • Gsi Technology Inc • Semiconductors & related devices • California
This Agreement dated, for reference purposes only, as of September 15, 2009 is between JAMES S. LINDSEY AND SALLY K. LINDSEY, TRUSTEES, OR THEIR SUCCESSORS, OF THE LINDSEY FAMILY TRUST DATED MAY 25, 2004, as to an undivided 85% interest and KHALIL JENAB AND TIFFANY RENEE JENAB, TRUSTEES OF THE JENAB FAMILY 1997 TRUST DATED DECEMBER 11, 1997, as to an undivided 15% interest (collectively, “Seller”), and GSI Technology, Inc. or Nominee (“Buyer”). As used herein, the “Effective Date” shall mean the date of the last execution and delivery hereof sufficient to form a binding contract between the parties.
Shares* GSI TECHNOLOGY, INC. Common Stock UNDERWRITING AGREEMENTGsi Technology Inc • March 12th, 2007 • Semiconductors & related devices • New York
NEEDHAM & COMPANY, LLC WR HAMBRECHT + CO., LLC ROBERT W. BAIRD & CO. INCORPORATED STANFORD GROUP COMPANY As Representatives of the several Underwriters c/o Needham & Company, LLC 445 Park Avenue New York, New York 10022
Tai Yuan Hi-Tech Industrial Park Factory Lease AgreementFactory Lease Agreement • July 13th, 2023 • Gsi Technology Inc • Semiconductors & related devices
for the purpose of reantal of properties in Tai Yuan Hi-Tech Industrial Park. Both parties to this agreement concur to comply with the conditions hereinbelow provided:
