LEADIS TECHNOLOGY, INC. Form of Change in Control Severance Benefits Agreement for CEO Effective as of June , 2006Leadis Technology Inc • June 14th, 2006 • Semiconductors & related devices • California
The Board of Directors (the “Board”) of Leadis Technology, Inc. (the “Company”) has determined that it is in the best interests of the Company and its stockholders to assure that the Company will continue to have your dedication and services notwithstanding the possibility or occurrence of a Change in Control (as defined below). The Board believes it is imperative to diminish any distraction that you might face by virtue of the personal uncertainties created by a pending or possible Change in Control and to encourage your full attention and dedication to the Company currently and in the event of any possible or pending Change in Control. Accordingly, the Board desires to provide you with a severance benefits arrangement in the event of a qualifying termination of employment within 24 months after a Change in Control that ensures that your compensation and benefits expectations will be satisfied and that is competitive with those of other comparable companies. In order to accomplish the
EMPLOYMENT AGREEMENTEmployment Agreement • August 5th, 2005 • Leadis Technology Inc • Semiconductors & related devices • California
This Employment Agreement (the “Agreement”) is entered into as of March 21, 2005 by and between Leadis Technology, Inc., a Delaware corporation (the “Company”), and Chol Chong (the “Employee”).
Underwriting AgreementUnderwriting Agreement • June 14th, 2004 • Leadis Technology Inc • Semiconductors & related devices • New York
Leadis Technology, Inc., a Delaware corporation (the “Company”), proposes, subject to the terms and conditions stated herein, to issue and sell to the Underwriters named in Schedule I hereto (the “Underwriters”) an aggregate of 6,000,000 shares (the “Firm Shares”) and, at the election of the Underwriters, up to 900,000 additional shares (the “Optional Shares”) of Common Stock (the “Stock”) of the Company (the Firm Shares and the Optional Shares that the Underwriters elect to purchase pursuant to Section 2 hereof being collectively called the “Shares”).
EMPLOYMENT AGREEMENTEmployment Agreement • March 24th, 2004 • Leadis Technology Inc • California
This Employment Agreement (the “Agreement”) is entered into as of August 15, 2002 (the “Effective Date”) by and between Leadis Technology, Inc., a Delaware corporation (the “Company”), and Keunmyung Lee (The “Employee”).
Lease ContractNotarial Certificate • April 30th, 2004 • Leadis Technology Inc • Semiconductors & related devices
As the supplementary provision for the attached General Conditions of the Contract, Special Conditions of the Contract and Lease Contract, the above Lessor and Lessee conclude Lease Contract. In order to prove the conclusion of this contract, the contract sheet is executed in 2 copies, each of which shall be signed, sealed and kept by each party.
Lease ContractNotarial Certificate • April 30th, 2004 • Leadis Technology Inc • Semiconductors & related devices
As the supplementary provision for the attached General Conditions of the Contract, Special Conditions of the Contract and Lease Contract, the above Lessor and Lessee conclude Lease Contract. In order to prove the conclusion of this contract, the contract sheet is executed in 2 copies, each of which shall be signed, sealed and kept by each party.
INDEMNITY AGREEMENTIndemnity Agreement • March 24th, 2004 • Leadis Technology Inc • Delaware
THIS AGREEMENT is made and entered into this day of , 2004 by and between Leadis Technology, Inc., a Delaware corporation (the “Corporation”), and (“Agent”).
WARRANT TO PURCHASE COMMON STOCK OF LEADIS TECHNOLOGY, INC.Purchase Agreement • March 24th, 2004 • Leadis Technology Inc • California
This Warrant is issued pursuant to that certain Series 1 Preferred Stock and Common Stock Warrant Purchase Agreement dated as of October 6, 2000 (the “Purchase Agreement”), by and between the Company and the Investor, and is subject to the provisions thereof.
EMPLOYMENT AGREEMENTEmployment Agreement • December 1st, 2005 • Leadis Technology Inc • Semiconductors & related devices • California
This Employment Agreement (the “Agreement”) is entered into as of November 28, 2005 by and between Leadis Technology, Inc., a Delaware corporation (the “Company”), and Antonio R. Alvarez (the “Executive”).
First Amendment to Lease AgreementFirst Amendment to Lease Agreement • November 8th, 2007 • Leadis Technology Inc • Semiconductors & related devices
This First Amendment to Lease Agreement (the “Amendment”) is made and entered into to be effective as of July 30, 2007, by and between SUNNYVALE BUSINESS PARK I, LLC, a Delaware limited liability company, and SUNNYVALE BUSINESS PARK SUB, LLC, a Delaware limited liability company (collectively, “Landlord”), and LEADIS TECHNOLOGY, INC., a Delaware corporation (“Tenant”), with reference to the following facts:
ASSET PURCHASE AGREEMENT among: LEADIS TECHNOLOGY. INC., a Delaware corporation; and IXYS CH GMBH, a Swiss entity Dated as of August 15, 2009Asset Purchase Agreement • August 18th, 2009 • Leadis Technology Inc • Semiconductors & related devices • California
THIS ASSET PURCHASE AGREEMENT is entered into as of August 15, 2009, by and among: LEADIS TECHNOLOGY, INC., a Delaware corporation (the “Seller”) and IXYS CH GmbH, a Swiss entity (the “Purchaser”). Certain capitalized terms used in this Agreement are defined in Exhibit A.
EMPLOYMENT AGREEMENTEmployment Agreement • January 26th, 2006 • Leadis Technology Inc • Semiconductors & related devices • California
This Employment Agreement (the “Agreement”) is entered into as of January 20, 2006 by and between Leadis Technology, Inc., a Delaware corporation (the “Company”), and Jose Arreola (the “Executive”).
FRAMEWORK AGREEMENTFramework Agreement • March 25th, 2005 • Leadis Technology Inc • Semiconductors & related devices • California
Philips Electronics Hong Kong Limited – Mobile Display Systems, having its office situated at Unit 207 to Unit 221 of the 2nd floor of Building 7, Phase One of Hong Kong Science Park, Pak Shek Kok, New Territories, Hong Kong, for the purpose hereof also acting for the benefit of the Mobile Display Systems of the Philips Semiconductors Division which forms part of the Philips Companies (“Philips”),
SUBLEASESublease • March 24th, 2004 • Leadis Technology Inc
THIS SUBLEASE (this “Sublease”) is dated for reference purposes as of December 23, 2002, and is made by and between Leadis Technology, Inc., a Delaware corporation (“Sublessee”), and MTI, a Delaware corporation (“Sublessor”).
Joint Filing AgreementJoint Filing Agreement • February 6th, 2009 • Leadis Technology Inc • Semiconductors & related devices
In accordance with Rule 13d-1(k)(1) under the Securities Exchange Act of 1934, as amended, the undersigned hereby agree to the joint filing with all other Reporting Persons (as such term is used in the Schedule 13G) on behalf of each of them of a statement on Schedule 13G (including amendments thereto) with respect to the common stock, par value $0.001 per share, of Leadis Technology, Inc., and that this Agreement be included as an Exhibit to such joint filing. This Agreement may be executed in any number of counterparts all of which taken together shall constitute one and the same instrument.
WAIVER AND AMENDMENT TO WARRANT ISSUANCE AGREEMENTWarrant Issuance Agreement • March 24th, 2004 • Leadis Technology Inc
This Waiver and Amendment to Warrant Issuance Agreement (this “Amendment”) is made and entered into effective as of January 29, 2004 (the “Amendment Date”) by and between Leadis Technology, Inc., a Delaware corporation (the “Company”) and Koninklijke Philips Electronics N.V., a company organized under the laws of the Netherlands (“Philips”), with reference to the following facts and circumstances:
INVESTORS’ RIGHTS AGREEMENTInvestors’ Rights Agreement • March 24th, 2004 • Leadis Technology Inc • California
This Investors’ Rights Agreement (this “Agreement”) is made and entered into as of August 19, 2002 (the “Effective Date” by and among Leadis Technology, Inc., a Delaware corporation (the “Company”) and the persons and entities listed on Exhibit A attached hereto (the “Investors”).
Lease ContractLeadis Technology Inc • August 8th, 2006 • Semiconductors & related devices
As the supplementary provision for the attached General Conditions of the Contract, Special Conditions of the Contract and Supplementary Regulation of the Lease Contract (Obligation), the above Lessor and Lessee conclude Lease Contract. In order to prove the conclusion of this contract, the contract sheet is executed in 3 copies, each of which shall be signed, sealed and kept by each party.
SUMMARY OF BASIC LEASE INFORMATIONLeadis Technology Inc • March 25th, 2005 • Semiconductors & related devices
This Lease, which includes the preceding Summary attached hereto and incorporated herein by this reference (the Lease and Summary to be known sometimes collectively hereafter as the “Lease”), dated as of the date set forth in Section 1 of the Summary, is made by and between SUNNYVALE BUSINESS PARK, a California limited partnership (“Landlord”), and LEADIS TECHNOLOGY, INC., a Delaware Corporation (“Tenant”)).
WARRANT TO PURCHASE SERIES B PREFERRED STOCK of LEADIS TECHNOLOGY, INC.Leadis Technology Inc • March 24th, 2004
This certifies that, for value received, Koninklijke Philips Electronics N.V. (“Holder”) is entitled, subject to the terms set forth below, to purchase from Leadis Technology, Inc. (the “Company”), a Delaware corporation, 128,040 shares of the Series B Preferred Stock of the Company (the “Series B Preferred Stock”), as constituted on the date hereof (the “Warrant Issue Date”), upon surrender hereof, at the principal office of the Company referred to below, with the subscription form attached hereto duly executed, and simultaneous payment therefor in lawful money of the United States or otherwise as hereinafter provided, at the Exercise Price (as defined below) as set forth in Section 2 below. The number, character and Exercise Price of such shares of Series B Preferred Stock are subject to adjustment as provided below. The term “Warrant” as used herein shall include this Warrant, issued pursuant to that certain Warrant Issuance Agreement dated as of June 21, 2001 (the “Warrant Issuance
